Now in Stock: Ultra-Wideband (UWB) and Bluetooth LE Modules

The Sera NX040 delivers precise, granular positioning an processing for medical and industrial IoT devices.

Published on January 9, 2024

Now in Stock: Ultra-Wideband (UWB) and Bluetooth LE Modules

The Sera NX040 module series is now in stock and innovatively combines UWB and Bluetooth Low Energy (LE) into one solution that delivers precise, granular positioning and processing for medical and industrial IoT applications.

This UWB tag solution seamlessly integrates the cutting edge Trimension™ SR040 chipset UWB silicon from NXP Semiconductors with the processing and Bluetooth LE capabilities of Nordic Semiconductor’s nRF52833 system-on-chip (SoC). This innovative combination, paired with our added value hardware, software, and services, brings new possibilities for UWB to grow beyond consumer and automotive segments into mainstream IoT devices. 

Key features and benefits:

  • NXP Trimension™ SR040 – IEEE 802.15.4z UWB silicon
  • Nordic Semiconductor nRF52833 – Bluetooth LE, NFC and MCU 
    • ARM Cortex M4 (64 MHz) - 512kB / 128kB
  • Small form factor PCB modules with multiple antenna options
  • Seamless multiprotocol integration 
    • Bluetooth LE 5.4 and NFC
    • UWB - channels 5 and 9
  • Flexible I/O – GPIO, UART, I2C, SPI, USB
  • All required external components, crystals, filters and 
  • additional 8Mbit Flash
  • Ultra-low power consumption with coin cell operation
  • Industrial temperature range -40 °C to +85 °C  
  • Regulatory – FCC, ISED, UKCA, CE, Bluetooth SIG 
    • MIC, RCM, FiRa Consortium (pending)

Visit the product page for more information, detailed documentation, and links to buy directly from our distribution partners.