NX611 Series - 1218 Module

Scope

This document describes key hardware aspects of the Ezurio Sona™NX611 1218  series wireless modules providing either SDIO for WLAN connection or UART/PCM for Bluetooth^® connection. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources and includes information found in the NXP NX611 and NX612 data sheets along with other documents provided from NXP.

Introduction

Overview

This document describes key hardware aspects of the Sona NX611 M.2 1218 module. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources. For full documentation on the Sona NX611, visit:

https://www.ezurio.com/support/series/sona-nx611

General Description

The Sona™NX611 series wireless modules are highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6, Bluetooth/Bluetooth Low Energy 5.4 single-chip solution optimized for a broad array of IoT and industrial applications.

This device is pre-calibrated and integrates the complete transmit/receive RF paths including diplexer, LNA’s, RF switches, reference crystal oscillator, and power management units (PMU).

Sona™NX611 include a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology bringing higher throughput, better network efficiency, lower latency, and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband, and direct-conversion radio with integrated PA, LNA, and transmit/receive switch removing the need for an RF front end module (FEMs), saving cost, and reducing system complexity.

The SONA™NX611 with integrated antenna wireless module ordering information is listed below.

This datasheet is subject to change. Please contact Ezurio for further information.

Features & Benefits

The Sona NX611 M.2 1218 device features and benefits are described in the following table.

Specification Summary

Processor / SoC / Chipset

Wi-Fi

Bluetooth

Radio Performance

Interfaces

Power

Mechanical

Software

Environmental

Certifications

Development

Warranty

Functional Descriptions

Bluetooth Functional Description

I2S/PCM Interface Signals

Clock Frequency and Audio Data Resolutions

Audio data may arrive with different input data formats with different sampling rates.

In master mode, the I2S interface uses an audio input clock of 4.096 MHz or 2.048 MHz to provide the appropriate M clock (MCLK) and bit clock (I2S_BCLK) frequency to match the sampling rates of each audio data format. The sampling rates can be 8 kHz to 16 kHz.

In slave mode, the I2S interface does not provide the bit clock (I2S_BCLK) but it can provide the M clock (MCLK).

Hardware Architecture

Block Diagrams

Pin-Out / Package Layout

Mechanical Drawings

Host Interface Specifications

Power Supplies

Power-up sequence

The Sona NX611 does not have power-up sequence requirements. The power-down pin (PDn) must be held low (asserted) until all external clock and power supply rails are stable.

Power-down

The Sona NX611 modules can enter the lowest power mode when Wi-Fi and Bluetooth are inactive. To achieve this, you can assert the PDn (Power Down) pin low, which puts the module into power-down mode. The same power-down state can be achieved by powering off   3V3, 1V8, VIO_GPIO and VIO_SD.

After PDn is deasserted (high), the device takes 20 ms to get ready for SDIO enumeration.

PDn Pin (Power Down Timing)-Power remains high at PDn assertion

Wake-up/Interrupt Pins

Deep sleep mode is used to reduce power consumption. Optional wake up input pins are used to wake up the Sona NX611 from sleep. Optional wake up output pins can be used to wake up a host or signal a host that WiFi or Bluetooth data is available.

Wake-up/interrupt pins (MFP)

Software reset pins (MFP)

Software reset pins can be used to independently reset the Wi-Fi and Bluetooth radios.

SDIO Specifications

The SONA™NX611 series wireless module SDIO host interface pins are powered from the VIO_SD voltage supply.

The SDIO electrical specifications are identical for the 1-bit SDIO and 4-bit SDIO modes.

1.8V Operation

DC electricals—1.8V operation (VIO_SD)

3.3V Operation

DC electricals — 1.8V operation (VIO_SD)

Default Speed, High-Speed Modes

SDIO Timing Requirements

SDR12, SDR25, SDR50 Mode (up to 100 MHz) (VIO_SD 1.8V)

SDIO timing requirements--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (VIO_SD 1.8V)

SDR104 Mode (208 MHz) (VIO_SD 1.8V)

SDIO timing requirements -- SDR104 modes (up to 208MHz) (VIO_SD 1.8V)

DDR50 Mode (50 MHz) (VIO_SD 1.8V)

SDIO timing requirements – DDR50 modes (50 MHz)

SDIO internal pull-up/pull-down specifications

High-Speed UART Specifications

The Sterling 70 supports a high-speed Universal Asynchronous Receiver/Transmitter (UART)interface, compliant to the industry standard 16550 specification.  High-speed baud rates are supported to provide the physical transport between the device and the host for exchanging Bluetooth data. The UART Tx and Rx pins are powered from the VIO voltage supply.

PCM timing specification – master mode

External Radio Coexistence Interface Specifications

WCI-2 coexistence interface supports the messages defined in Bluetooth Core Specification Vol 7 Part C for request and grant, where:

• The real time message from the external radio to NX611 indicates the request to operate

  • MWS_Rx=1 indicates an external radio request to Rx
  • MWS_Tx=1 indicates an external radio request to Tx

Table 28: WCI-2 Coexistence Interface Pins

Bluetooth Digital Audio Interface Specifications

I2S/PCM Interface Specifications

• Central or peripheral mode

• I2S (Inter-IC Sound) interface for audio data connection to Analog-to-Digital Converters (ADC) and Digital-to- Analog Converters (DAC)

• 3-state I2S interface capability

• I2S pins shared with PCM pins

• Supports clock speeds of 4.096 MHz, 2.048 MHz, and 2 MHz Central or peripheral mode

• PCM bit width size of 8 bits or 16 bits

• Up to 4 slots with configurable bit width and start positions

• 3-state PCM/I2S interface capability

• PCM short frame and long frame5 synchronization

• PCM pins shared with I2S pins

• Supports clock speeds of 4.096 MHz, 2.048 MHz, and 2 MHz

The PCM pins are powered by VIO voltage supply.

PCM timing specification – master mode

PCM timing specification – slave mode

Electrical Characteristics

Absolute Maximum Ratings

Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended.

Recommended Operating Conditions

DC Electrical Characteristics

General DC electrical characteristics (For 1.8V or 3.3V operation VIO)

General DC electrical characteristics (For 1.8V or 3.3V operation VIO_SD)

Current Consumption

25 MHz clock (4-bit mode).

Radio Characteristics

WLAN

WLAN Radio Receiver Characteristics

Typical WLAN receiver characteristics for 2.4 GHz Band, WLAN Channels 1-11, single chain operation at 25 degrees C, ambient temperature.

Typical WLAN receiver characteristics for 5 GHz Channels 36-48, 52-64,100-140,149-165, Band, Channels single chain operation at 25 degrees C ambient temperature.

WLAN Transmitter Characteristics

Typical WLAN transmitter characteristics for 2.4 GHz band operation (VDD=3.3V, VIO=1.8V), WLAN Channels 1-11, single chain operation at 25 degrees C, ambient temperature.

Typical WLAN Transmitter characteristics for 5 GHz band operation, (VDD=3.3V, VIO=1.8V), Channels 36-48, 52-64,100-140,149-165, Band, Channels single chain operation at 25 degrees C ambient.

Bluetooth

Bluetooth Receiver Characteristics

Typical Bluetooth/Bluetooth LE receiver performance at AVDD33=3.3 VDC and VIO=1.8 V, 25 degrees C, ambient temperature.

Bluetooth Transmitter Characteristics

Typical Bluetooth/Bluetooth LE Transmitter performance at AVDD33=3.3 VDC and VIO=1.8 V, 25 degrees C, ambient temperature.

Integration Guidelines

Antenna Characteristics

Antenna Measurement Test Set Up

2.4 GHz Radiation Patterns

5 GHz Radiation Patterns

Example TRP based on conducted output powers of 0 dBm and -1 dBm at each frequency of 2442 MHz and 5180 MHz.

Antenna Radiation Performance Summary

Application Note for Surface Mount Modules

Introduction

Ezurio’s surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the user manual. This application note is considered a living document and will be updated as new information is presented.

The modules are designed to meet the needs of several commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.

Shipping and Labeling

There are 1,000 SONA™NX611 1218 Chip Antenna modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5,000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels.

The following labels are located on the anti-static bag. Sona NX611 1218 Chip Antenna modules are MSL4 modules.

The following label is located on the pizza box.

The following package label is located on adjacent sides of the master carton.

Recommended Stencil Aperture

When soldering, the stencil thickness should be ≥ 0.1 mm.

Soldering

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)

• Measuring point – IC package surface

• Temperature profile:
  

  
• Ramp-up: 40-130˚C. Less than 2.5˚C/sec
• Pre heat: 130-180˚C 60-120 sec, 180˚C MAX
• Ramp-up: 180-220˚C. Less than 3˚C/sec

• Peak Temperature: MAX 250˚C

  • 225˚C ~ 250˚C, 30 ~ 50 sec
• Ramp-down: Less than 3˚C/sec

Cautions when Removing the SIP from the Platform for RMA

• Bake the platform PCBA before removing the M.2 1218 module from the platform.
• Remove the M.2 1218 module by using a hot air gun. This process should be carried out by a skilled technician.

Recommended conditions for one-side component platform:

• Set the hot plate at 280°C.
• Put the platform on the hot plate for 8~10 seconds.
• Remove the device from platform.

Recommended conditions for two-side components platform:

• Use two hot air guns.
• On the bottom, use a pre-heated nozzle (temp setting of 200~250°C) at a suitable distance from the platform PCB.

• On the top, apply a remove nozzle (temp setting of 330°C). Heat until device can be removed from platform PCB.

  
• Remove the residue solder under the bottom side of device. (Note: Alternate module pictured as an example)

(Not accepted for RMA)	(Accepted for RMA analysis)

• Remove and clean the residue flux as needed.

Precautions for Use

• Opening/handing/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment.
• The devices should be mounted within one year of the date of delivery.
• The SONA™NX611 M2 modules are MSL level 1.

Environmental and Reliability

Environmental Requirements

Required Storage Conditions

Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

• Normal temperature: 5~40˚C
• Normal humidity: 80% (Relative humidity) or less
• Storage period: One year or less

After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

• Storage conditions for one-time soldering:

  • Temperature: 5-25°C
  • Humidity: 60% or less
  • Period: 72 hours or less after opening

• Storage conditions for two-time soldering

  • Storage conditions following opening and prior to performing the 1^st reflow:

    • Temperature: 5-25°C
    • Humidity: 60% or less
    • Period: A hours or less after opening

  • Storage conditions following completion of the 1^st reflow and prior to performing the 2^nd reflow

    • Temperature: 5-25°C
    • Humidity: 60% or less
    • Period: B hours or less after completion of the 1st reflow

Temporary Storage Requirements after Opening

The following are temporary storage requirements after opening:

• Only re-store the devices once prior to soldering.
• Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing.

The following indicate the required storage period, temperature, and humidity for this temporary storage:

• Storage temperature and humidity:

  

*** - External atmosphere temperature and humidity of the dry packing

• Storage period:

  • X1+X2 – Refer to Material handling information
  • Required Storage Conditions.  Keep is X1+X2 within 72 hours.
  • Y – Keep within two weeks or less.

Baking Conditions

Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:

• The calculated shelf life in a sealed bag is 12 months at <40℃ and <80% relative humidity.
• Once the packaging is opened, the SiP must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30˚C and <60% relative humidity.

If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ˚C (±5 ˚C).

Reflow Profile

Reliability Tests

Environmental and Mechanical

Climatic and Dynamic

Climatic and Dynamic Reliability Test Results for Sona NX611 Modules

Reliability MTBF Prediction

Regulatory, Qualification & Certifications

Regulatory Approvals

The SONA™NX611 holds current certifications in the following countries:

SONA™NX611 countries with certification (M.2 1218 Chip Antenna Module)

Bluetooth SIG Qualification

The Bluetooth Qualification Process promotes global product interoperability and reinforces the strength of the Bluetooth® brand and ecosystem to the benefit of all Bluetooth SIG members. The Bluetooth Qualification Process helps member companies ensure their products that incorporate Bluetooth technology comply with the Bluetooth Patent & Copyright License Agreement and the Bluetooth Trademark License Agreement (collectively, the Bluetooth License Agreement) and Bluetooth Specifications.

The Bluetooth Qualification Process is defined by the Qualification Program Reference Document (QPRD) v3.

To demonstrate that a product complies with the Bluetooth Specification(s), each member must for each of its products:

• Identify the product, the design included in the product, the Bluetooth Specifications that the design implements, and the features of each implemented specification
• Complete the Bluetooth Qualification Process by submitting the required documentation for the product under a user account belonging to your company

The Bluetooth Qualification Process consists of the phases shown below:

To complete the Qualification Process the company developing a Bluetooth End Product shall be a member of the Bluetooth SIG.  To start the application please use the following link: Apply for Adopter Membership

Scope

This guide is intended to provide guidance on the Bluetooth Qualification Process for End Products that reference multiple existing designs, that have not been modified, (refer to Section 3.2.2.1 of the Qualification Program Reference Document v3).

For a Product that includes a new Design created by combining two or more unmodified designs that have DNs or QDIDs into one of the permitted combinations in Table 3.1 of the QPRDv3, a Member must also provide the following information:

• DNs or QDIDs for Designs included in the new Design
• The desired Core Configuration of the new Design (if applicable, see Table 3.1 below)
• The active TCRL Package version used for checking the applicable Core Configuration (including transport compatibility) and evaluating test requirements

Any included Design must not implement any Layers using withdrawn specification(s).

When creating a new Design using Option 2a, the Inter-Layer Dependency (ILD) between Layers included in the Design will be checked based on the latest TCRL Package version used among the included Designs.

For the purposes of this document, it is assumed that the member is combining unmodified Core-Controller Configuration and Core-Host Configuration designs, to complete a Core-Complete Configuration.

Qualification Steps When Referencing multiple existing designs, (unmodified) – Option 2a in the QPRDv3

For this qualification option, follow these steps:

1. To start a listing, go to: https://qualification.bluetooth.com/
2. Select Start the Bluetooth Qualification Process.

3. Product Details to be entered:

   1. Project Name (this can be the product name or the Bluetooth Design name).
   2. Product Description
   3. Model Number
   4. Product Publication Date (the product publication date may not be later than 90 days after submission)
   5. Product Website (optional)
   6. Internal Visibility (this will define if the product will be visible to other users prior to publication)
   7. If you have multiple End Products to list then you can select ‘Import Multiple Products’, firstly downloading and completing the template, then by ‘Upload Product List’.  This will populate Qualification Workspace with all your products.

4. Specify the Design:

   1. Do you include any existing Design(s) in your Product? Answer Yes, I do.
   2. Enter the multiple DNs or QDIDs used in your, (for Option 2a two or more DNs or QDIDs must be referenced)
   3. Select ‘I’m finished entering DN’s
   4. Once the DNs or QDIDs are selected they will appear on the left-hand side, indicating the layers covered by the design (should show Core-Controller and Core Host Layers covered).
   5. What do you want to do next? Answer, ‘Combine unmodified Designs’.
   6. The Qualification Workspace Tool will indicate that a new Design will be created and what type of Core-Complete configuration is selected.
   7. An active TCRL will be selected for the design.
   8. Perform the Consistency Check, which should result in no inconsistencies
   9. If there are any inconsistencies these will need to be resolved before proceeding
   10. Save and go to Test Plan and Documentation

5. Test Plan and Documentation

   1. As no modifications have been made to the combined designs the tool should report the following message:
      ‘No test plan has been generated for your new Design. Test declarations and test reports do not need to be submitted. You can continue to the next step.’
   2. Save and go to Product Qualification fee

6. Product Qualification Fee:

   1. It’s important to make sure a Prepaid Product Qualification fee is available as it is required at this stage to complete the Qualification Process.
   2. Prepaid Product Qualification Fee’s will appear in the available list so select one for the listing.
   3. If one is not available select ‘Pay Product Qualification Fee’, payment can be done immediately via credit card, or you can pay via Invoice.  Payment via credit will release the number immediately, if paying via invoice the number will not be released until the invoice is paid.
   4. Once you have selected the Prepaid Qualification Fee, select ‘Save and go to Submission’

7. Submission:

   1. Some automatic checks occur to ensure all submission requirements are complete.
   2. To complete the listing any errors must be corrected
   3. Once you have confirmed all design information is correct, tick all of the three check boxes and add your name to the signature page.
   4. Now select ‘Complete the Submission’.
   5. You will be asked a final time to confirm you want to proceed with the submission, select ‘Complete the Submission’.
   6. Qualification Workspace will confirm the submission has been submitted.  The Bluetooth SIG will email confirmation once the submission has been accepted, (normally this takes 1 working day).

8. Download Product and Design Details (SDoC):

   1. You can now download a copy of the confirmed listing from the design listing page and save a copy in your Compliance Folder

For further information, please refer to the following webpage:

https://www.bluetooth.com/develop-with-bluetooth/qualification-listing/

Example Design Combinations

The following gives an example of a design possible under option 2a:

Ezurio Controller Subsystem + BlueZ 5.50 Host Stack (Ezurio Sona NX611 based design)

Qualify More Products

If you develop further products based on the same design in the future, it is possible to add them free of charge.  The new product must not modify the existing design i.e add ICS functionality, otherwise a new design listing will be required.

To add more products to your design, select ‘Manage Submitted Products’ in the Getting Started page, Actions, Qualify More Products.  The tool will take you through the updating process.

Ordering Information

Legacy - Revision History