NX611 Series - SIP, M.2 1216, M.2 2230

Scope

This document describes key hardware aspects of the Ezurio Sona™NX611 series wireless modules providing either SDIO for WLAN connection or UART/PCM for Bluetooth^® connection. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources and includes information found in the NXP NX611 and NX612 data sheets along with other documents provided from NXP.

Introduction

Overview

This document describes key hardware aspects of the Sona NX611 SIP, M.2 1216, and M.2 2230 modules. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources. For full documentation on the NX611, visit:

https://www.ezurio.com/nx611-series

General Description

The Sona™NX61x series wireless modules are highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6, Bluetooth/Bluetooth Low Energy 5.4 single-chip solution optimized for a broad array of IoT and industrial applications.

This device is pre-calibrated and integrates the complete transmit/receive RF paths including diplexer, LNA’s, RF switches, reference crystal oscillator, and power management units (PMU).

Sona™NX611 include a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology bringing higher throughput, better network efficiency, lower latency, and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband, and direct-conversion radio with integrated PA, LNA, and transmit/receive switch removing the need for an RF front end module (FEMs), saving cost, and reducing system complexity.

The SONA™NX611 series wireless modules include several product SKUs with different form factor, integration levels and RF paths. Please contact Ezurio Sales/FAE for further information. Ordering information is listed below.

This datasheet is subject to change. Please contact Ezurio for further information.

Features & Benefits

The Sona NX611 device features and benefits are described in the following table.

Specification Summary

Processor / SoC / Chipset

Wi-Fi

Bluetooth

Radio Performance

Interfaces

Power

Mechanical

Software

Environmental

Certifications

Development

Warranty

Functional Descriptions

Bluetooth Functional Description

I2S/PCM Interface Signals

Clock frequency and audio data resolutions

Audio data may arrive with different input data formats with different sampling rates.

In master mode, the I2S interface uses an audio input clock of 4.096 MHz or 2.048 MHz to provide the appropriate M clock (MCLK) and bit clock (I2S_BCLK) frequency to match the sampling rates of each audio data format. The sampling rates can be 8 kHz to 16 kHz.

In slave mode, the I2S interface does not provide the bit clock (I2S_BCLK) but it can provide the M clock (MCLK).

Hardware Architecture

Block Diagrams

Sona NX611 SIP- 2 RF Trace Pin

Sona NX611 SIP- 1 RF Trace Pin

Sona NX611 1216 - 2 Trace Pin/MH4 Connector

Sona NX611 1216- 1 RF Trace Pin/MH4 Connector

Sona NX611 M.2 2230- 2 MH4 Connector

Sona NX611 M.2 2230- 1 MH4

Pin-Out

The pin states information provided in the tables includes:

• No Pad Power State indicates the state when there is no power
• PwrDwn State denotes the power-down state in default configuration. Many pads have programmable power down values, which can be set by firmware.
• Reset State is the state after the power-on-reset state and before the hardware state (HW State)
• HW State (hardware state) is the state after boot code finishes and before firmware download begins (firmware may change the pin state). HW State may differ based on the pin muxing/strap setting. For example, for UART_RTSn and UART_SOUT, the boot code will enable the UART interface when the device is in SDIO-UARTmode, making the HW states output high and output low, respectively.
• PwrDwn Prog indicates if the power-down state can be programmed

• Internal PU/PD columns indicates the following (the internal pull-up or pull-down applies when the pin is in input mode):

  • Type of PU/PD (weak vs nominal)
  • The polarity (PU vs. PD)
• PU denotes whether the pull-up can be programmed or not
• PD denotes whether the pull-down can be programmed or not
• Pull-up and pull-down are only effective when the pad is in input mode

• After firmware is downloaded, the pads (GPIO, RF control, and so on) are programmed in functional mode per the functionality of the pins

  • Internal weak pull-up resistance 800kΩ
  • Internal nominal pull-up resistance  100kΩ
  • All pins No Pad power state are tristate

NX611 SiP Pinout

NX611 M.2 1216 Pinout

NX611 M.2 2230 Key E Pinout

Mechanical Drawings

NX611 SIP Module

NX611 1216 Module

NX611 M.2 2230 Key-E Module

M.2 2230 Key-E Mounting

The Sona NX611 M.2 2230 Module connects to the host via a standard PCI EXPRESS M2 connector.

Mounting Connectors and Standoffs

Host Interface Specifications

Power Supplies

Power-up sequence

The Sona NX611 does not have power-up sequence requirements. The power-down pin (PDn) must be held low (asserted) until all external clock and power supply rails are stable.

PDn held low (asserted)

Power-down

The Sona NX611 modules can enter the lowest power mode when Wi-Fi and Bluetooth are inactive. To achieve this, you can assert the PDn (Power Down) pin low, which puts the module into power-down mode. The same power-down state can be achieved by powering off   3V3, 1V8, VIO_GPIO and VIO_SD.

After PDn is deasserted (high), the device takes 20 ms to get ready for SDIO enumeration.

PDn Pin (Power Down Timing)-Power remains high at PDn assertion

PDn Pin (Power Down Timing)-Power remains high at PDn assertion

Wake-up/Interrupt Pins

Deep sleep mode is used to reduce power consumption. Optional wake up input pins are used to wake up the Sona NX611 from sleep. Optional wake up output pins can be used to wake up a host or signal a host that WiFi or Bluetooth data is available.

Wake-up/interrupt pins (MFP)

Software reset pins (MFP)

Software reset pins can be used to independently reset the Wi-Fi and Bluetooth radios.

SDIO Specifications

The SONA™NX61X series wireless module SDIO host interface pins are powered from the VIO_SD voltage supply.
The SDIO electrical specifications are identical for the 1-bit SDIO and 4-bit SDIO modes.

1.8V Operation

DC electricals—1.8V operation (VIO_SD)

3.3V Operation

DC electricals — 1.8V operation (VIO_SD)

Default Speed, High-Speed Modes

SDIO timing requirements

SDR12, SDR25, SDR50 Mode (up to 100 MHz) (VIO_SD 1.8V)

SDIO timing requirements--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (VIO_SD 1.8V)

SDR104 Mode (208 MHz) (VIO_SD 1.8V)

SDIO timing requirements -- SDR104 modes (up to 208MHz) (VIO_SD 1.8V)

DDR50 Mode (50 MHz) (VIO_SD 1.8V)

SDIO timing requirements – DDR50 modes (50 MHz)

SDIO internal pull-up/pull-down specifications

High-Speed UART Specification

The NX611 supports a high-speed Universal Asynchronous Receiver/Transmitter (UART)interface, compliant to the industry standard 16550 specification.  High-speed baud rates are supported to provide the physical transport between the device and the host for exchanging Bluetooth data. The UART Tx and Rx pins are powered from the VIO voltage supply.

PCM timing specification – master mode

External Radio Coexistence Interface Specifications

WCI-2 and PTA external coexistence interfaces are used for the coexistence with an external radio. External radios can be connected to the 5-wire packet traffic arbitration interface (PTA) or the 2-wire wireless coexistence interface 2 (WCI-2).

The coexistence architecture has three major components:

• Central hardware Packet Traffic Arbiter (PTA): arbitrates between on-chip Wi-Fi and Bluetooth radios. Controls the front-end components such as RF switches.

• Local hardware arbiter: arbitrates the packets between Bluetooth and Bluetooth Low Energy (LE)

• Coexistence software: configures PTA and works with Wi-Fi and Bluetooth firmware

WCI-2 coexistence interface supports the messages defined in Bluetooth Core Specification Vol 7 Part C for request and grant, where:

• The real time message from the external radio to NX611 indicates the request to operate

  • MWS_Rx=1 indicates an external radio request to Rx
  • MWS_Tx=1 indicates an external radio request to Tx

WCI-2 Coexistence Interface Pins

PTA Coexistence Interface Pins

Bluetooth Digital Audio Interface Specifications

I2S/PCM Interface Specifications

• Central or peripheral mode

• I2S (Inter-IC Sound) interface for audio data connection to Analog-to-Digital Converters (ADC) and Digital-to- Analog Converters (DAC)

• 3-state I2S interface capability

• I2S pins shared with PCM pins

• Supports clock speeds of 4.096 MHz, 2.048 MHz, and 2 MHz Central or peripheral mode

• PCM bit width size of 8 bits or 16 bits

• Up to 4 slots with configurable bit width and start positions

• 3-state PCM/I2S interface capability

• PCM short frame and long frame5 synchronization

• PCM pins shared with I2S pins

• Supports clock speeds of 4.096 MHz, 2.048 MHz, and 2 MHz

The PCM pins are powered by VIO voltage supply.

PCM timing specification – master mode

PCM timing specification – slave mode

Electrical Characteristics

Absolute Maximum Ratings

Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended.

Recommended Operating Conditions

DC Electrical Characteristics

The following tables list the general DC electrical characteristics over recommended operating conditions (unless otherwise specified).

General DC electrical characteristics (For 1.8V or 3.3V operation VIO)

General DC electrical characteristics (For 1.8V or 3.3V operation VIO_SD)

Current Consumption

NX611 SIP Module Current Consumption

25 MHz clock (4-bit mode)

[1] SDIO host interface connected

[2] Wi-Fi enabled, SDIO host interface connected

[3] The peak transmit current remains the same across all Bluetooth LE data rates at the same transmit power level

[4] Single antenna configuration

[5] The peak receive current remains the same across all Bluetooth LE data rates

[6] The peak transmit current remains the same across all Bluetooth data rates at the same transmit power level

[7] The peak receive current remains the same across all Bluetooth data rates

[8] Bluetooth enabled

[9] Frame length in IEEE-PS current measurement: 5 GHz: 207 Bytes, 2.4 GHz: 222 Bytes

[10] Maximum value

[11] VIO, VIO_SD 3.3V

NX611 M.2 1216/ M.2 2230 Current Consumption

25 MHz clock (4-bit mode)

[1] SDIO host interface connected

[2] Wi-Fi enabled, SDIO host interface connected

[3] The peak transmit current remains the same across all Bluetooth LE data rates at the same transmit power level

[4] Single antenna configuration

[5] The peak receive current remains the same across all Bluetooth LE data rates

[6] The peak transmit current remains the same across all Bluetooth data rates at the same transmit power level

[7] The peak receive current remains the same across all Bluetooth data rates

[8] Bluetooth enabled

[9] Frame length in IEEE-PS current measurement: 5 GHz: 207 Bytes, 2.4 GHz: 222 Bytes

[10] Maximum value

Radio Characteristics

WLAN Radio Receiver Characteristics

Typical WLAN receiver characteristics for 2.4 GHz Band, WLAN Channels 1-11, single chain operation at 25 degrees C, ambient temperature.

Typical WLAN receiver characteristics for 5 GHz Channels 36-48, 52-64,100-140,149-165, Band, Channels single chain operation at 25 degrees C ambient temperature.

WLAN Transmitter Characteristics

Typical WLAN transmitter characteristics for 2.4 GHz band operation (VDD=3.3V, VIO=1.8V), WLAN Channels 1-11, single chain operation at 25 degrees C, ambient temperature.

Typical WLAN Transmitter characteristics for 5 GHz band operation, (VDD=3.3V, VIO=1.8V), Channels 36-48, 52-64,100-140,149-165, Band, Channels single chain operation at 25 degrees C ambient.

Bluetooth Transmitter Characteristics

Bluetooth Radio Receiver Characteristics

Typical Bluetooth/Bluetooth LE receiver performance at AVDD33=3.3 VDC and VIO=1.8 V, 25 degrees C, ambient temperature.

[1] Bluetooth/Bluetooth LE receiver refers to Dirty Tx. That is, the transmitter has impairments as specified by the Bluetooth SIG standard.

[2] De-sense of 2.7 dB at 2440 MHz, 0.5 dB at 2480 MHz

[3] De-sense of 3.4 dB at 2440 MHz, 1.2 dB at 2480 MHz

[4] De-sense of 3.6 dB at 2440 MHz, 1.1 dB at 2480 MHz

[5] De-sense of 3.8 dB at 2440 MHz, 0.8 dB at 2480 MHz

[6] De-sense of 2.1 dB at 2440 MHz, 0.6 dB at 2480 MHz

[7] De-sense of 3.4 dB at 2440 MHz, 0.6 dB at 2480 MHz

[8] De-sense of 5.3 dB at 2440 MHz, 1 dB at 2480 MHz

Bluetooth Radio Transmitter Characteristics

Typical Bluetooth/Bluetooth LE Transmitter performance at AVDD33=3.3 VDC and VIO=1.8 V, 25 degrees C, ambient temperature.

Application Note for Surface Mount Modules

Introduction

Ezurio’s surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the user manual. This application note is considered a living document and will be updated as new information is presented.

The modules are designed to meet the needs of several commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.

Shipping and Labeling

Base SiP Module Shipping

There are 1,000 SONA™NX61X SIP modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5,000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels.

Base 1216 Module Shipping

There are 1,000 SONA™NX61X 1216 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5,000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels.

Base 2230 Module Shipping

Labeling

The following labels are located on the anti-static bag. Sona NX611 SIPs and 1216 modules are MSL4 modules.

The following label is located on the pizza box.

The following package label is located on adjacent sides of the master carton.

Recommended Stencil Aperture

When soldering, the stencil thickness should be ≥ 0.1 mm.

Soldering

`Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)

• Measuring point – IC package surface

• Temperature profile:
  

  

• Ramp-up: 40-130˚C. Less than 2.5˚C/sec

• Pre heat: 130-180˚C 60-120 sec, 180˚C MAX

• Ramp-up: 180-220˚C. Less than 3˚C/sec

• Peak Temperature: MAX 250˚C

  • 225˚C ~ 250˚C, 30 ~ 50 sec
• Ramp-down: Less than 3˚C/sec

Cautions when Removing the SIP from the Platform for RMA

• Bake the platform PCBA before removing the SIP module from the platform.
• Remove the SIP module by using a hot air gun. This process should be carried out by a skilled technician.

Recommended conditions for one-side component platform:

• Set the hot plate at 280°C.
• Put the platform on the hot plate for 8~10 seconds.
• Remove the device from platform.

Recommended conditions for two-side components platform:

• Use two hot air guns.
• On the bottom, use a pre-heated nozzle (temp setting of 200~250°C) at a suitable distance from the platform PCB.

• On the top, apply a remove nozzle (temp setting of 330°C). Heat until device can be removed from platform PCB.

  
• Remove the residue solder under the bottom side of device. (Note: Alternate module pictured as an example)

(Not accepted for RMA)	(Accepted for RMA analysis)

• Remove and clean the residue flux as needed.

Precautions for Use

• Opening/handing/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment.

• The devices should be mounted within one year of the date of delivery.

• The SONA™NX61X SIP and 1216 modules are MSL level 4.

• The SONA™NX61X M2 modules are MSL level 1.

Environmental and Reliability

Environmental Requirements

Required Storage Conditions

Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

• Normal temperature: 5~40˚C
• Normal humidity: 80% (Relative humidity) or less
• Storage period: One year or less

After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

• Storage conditions for one-time soldering:

  • Temperature: 5-25°C
  • Humidity: 60% or less
  • Period: 72 hours or less after opening

• Storage conditions for two-time soldering

  • Storage conditions following opening and prior to performing the 1^st reflow:

    • Temperature: 5-25°C
    • Humidity: 60% or less
    • Period: A hours or less after opening

  • Storage conditions following completion of the 1^st reflow and prior to performing the 2^nd reflow

    • Temperature: 5-25°C
    • Humidity: 60% or less
    • Period: B hours or less after completion of the 1st reflow

Temporary Storage Requirements after Opening

The following are temporary storage requirements after opening:

• Only re-store the devices once prior to soldering.
• Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing.

The following indicate the required storage period, temperature, and humidity for this temporary storage:

• Storage temperature and humidity:

  

*** - External atmosphere temperature and humidity of the dry packing

• Storage period:

  • X1+X2 – Refer to Material handling information
  • Required Storage Conditions.  Keep is X1+X2 within 72 hours.
  • Y – Keep within two weeks or less.

Baking Conditions

Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:

• The calculated shelf life in a sealed bag is 12 months at <40℃ and <80% relative humidity.
• Once the packaging is opened, the SiP must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30˚C and <60% relative humidity.

If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ˚C (±5 ˚C).

Reliability Tests

Climatic and Dynamic

Reliability Prediction

Regulatory, Qualification & Certifications

Regulatory Approvals

SONA™NX61X countries with certification (SIP)