Veda IF912 (Preliminary)

Scope

This document describes key hardware aspects of the Ezurio Veda™ IF912 series wireless modules which is a ultra-lower power, single chip connected MCUs with 1x1 Wi-Fi 6 dual band, Bluetooth® Low Energy 5.4, Matter and IP networking. Integrated MCU, Radio, PMU, Flash and PSRAM in 11x7mm size that targeted at Internet-of- Things (IoT) applications for stand-alone operation or to offload a host-processor.

This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources and includes information found in the Infineon CYW55912 Reversion C 2024-10-30 data sheet, along with other documents provided by Infineon.

Introduction

Overview

The Veda IF912 series wireless module is a highly integrated, small form factor Wi-Fi/Bluetooth module that is optimized for low-power mobile devices.

The Veda IF912 integrated with all WLAN and Bluetooth functionality in a small package supports a low cost and simple implementation. The radio is pre-calibrated and integrates the complete transmit/receive RF paths including bandpass filter, diplexer, switches, reference crystal oscillator, and power management units (PMU). It is available in 7x11x1.4mm solder-down LGA form factors with an RF trace pin out for both Wi-Fi and BT.  

A reference certified embedded PCB antenna or the implementation of MHF4 connector for external antennas are available on Veda IF91x DVK, please contact Ezurio for detail information. A list of certified external antennas is shown in Certified Antennas.

Ordering information is listed in Ordering Information. Please contact Ezurio Sales/FAE for further information.

General Description

MCU: 192 MHz Arm® Cortex®-CM33, runs the Wi-Fi and Networking Stacks.

Memory:

• On-Chip memory: 2048-KB ROM and 768-KB RAM.   (No Embedded Memory variant)
• Embedded external memory: 8M PSRAM, 8M Flash. (Embedded Memory, 8M PSRAM, 8M Flash variant)

Wi-Fi:

• 1X1, IEEE 802.11a/b/g/n/ac/ax compliant.
• Dual-band (2.4/5GHz), 20 MHz channels supporting PHY data rates up to 802.11ax (MCS11 1024-QAM 5/6).
• Transmit (TX) power with internal PA and LNA.
• Wi-Fi 6 release feature:
• OFDMA uplink and downlink as STA
• Downlink multi-user MIMO as STA
• Individual target-wake-time (TWT)

Bluetooth^®:

• Bluetooth® 5.4 (Bluetooth® Low Energy)
• Advertising Coding Selection
• Encrypted Advertising Data
• LE Generic Attribute Profile (GATT) Security Levels Characteristic
• Bluetooth® Low Energy 5.0/5.1/5.2/5.3 features
• LE long range
• LE 2 Mbps
• LE mesh
• Advertising extensions

 Security:

• Arm® Trustzone Cryptocell 312  
• Life cycle management
• Crypto key establishment and management   Crypto offloads
• Secure boot
• Wi-Fi and Bluetooth® independent firmware authentication  
• Firmware encryption
• Attestation
• Anti-rollback prevention

This datasheet is subject to change. Please contact Ezurio for further information.

Specification Summary

Processor / SoC / Chipset

Wi-Fi

Standards	IEEE 802.11ax, 11ac, 11ac, 11a/b/g/n, 11d/h, 11i, 11r, 11w, 11e, 11k, 11ai, 11v
Wi-Fi Features	Advanced WLAN: IEEE 802.11a/b/g/n/ac/ax compliant, tri-band capable (2.4/5 GHz) 1x1 MIMO providing up to 143 Mbps PHY data rate for 2.4/5 GHz (1024-QAM modulation) Supports 20 MHz bandwidth with optional SGI (1024-QAM modulation) On-chip power amplifiers and low-noise amplifiers for both bands Support wide variety of WLAN encryption: WPA2(Personal/Enterprise), WPA3 (Personal/Enterprise with 192 bit security).
Spatial Streams	1 (1x1 MU-MIMO)
Supported Data Rates	Support 802.11 ax/ac/a/b/g/n 1x1 MU-MIMO. Standard Data Rates 802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps 802.11a/g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n (OFDM, HT20, MCS0-7) 802.11ac (OFDM, VHT20, MCS0-8) 802.11ax (2.4 GHz / OFDM / HE20 / MCS0-11; 2.4 GHz / OFDMA / HE20 / MCS0-11) 802.11ax (5 GHz / OFDM / HE20 / MCS0-11; 5 GHz / OFDMA / HE20 / MCS0-11)
Max Transmit Power	Up to +19 dBm
Min Transmit Power	Down to +10.5 dBm
Modulation Schemes	BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024-QAM (See Note)

Bluetooth

Radio Details

Radio Performance

Interfaces

Power

Mechanical

Software

Environmental

Certifications

Regulatory Compliance	United States (FCC) EU - Member countries of European Union (ETSI) Great Britain (UKCA) Canada (ISED) Australia/New Zealand (RCM) Japan (MIC)
Compliance Standards	EU EN 300 328 EN 301 489-1 EN 301 489-17 EN 301 893 EN 62368-1:2014 EN 300 440 EN 303 687 2011/65/EU (RoHS) FCC ISED Canada 47 CFR FCC Part 15.247 47 CFR FCC Part 15.407 47 CFR FCC Part 2.1091 RSS-247 RSS-248 AS/NZS MIC AS/NZS 4268:2017 ARIB STD-T66/RCR STD-33 (2.4 GHz) ARIB STD-T71 (5 GHz)
Bluetooth SIG	Bluetooth® SIG Qualification TBD

Development

Hardware Architecture

Block Diagrams

Pin-Out / Package Layout

Mechanical Drawings

Veda IF912 SIP package is 11 x 7 x 1.4 mm.

Integration Guidelines

Antenna Integration

MHF4 and Embedded PCB antenna

The Veda IF912 DVK design has two antenna connection options which are MHF4 and embedded PCB antenna. Pop on R15, users can get the RF signal out at MHF4 connector for external antenna. Pop on R16 will allow users to use the embedded PCB antenna.

Please copy the components’ location for the RF trace from the DVK to maintain the RF performance and adopt Ezurio certification grant.

Certified Antennas

The Veda IF912 module was tested with antennas listed in the following table. The OEM can choose a different manufacturer’s antenna but must make sure it is of same type and that the gain is less than or equal to the antenna that is approved for use.

Host Platform Implementation Details

Power-Up Sequence and Timing

To maintain stable MCU and Bluetooth starting up, below power up sequency timing is required.

• VBAT and VDDIO should not rise 10%–90% faster than 40 microseconds.
• VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.

L-C filter for Buck switching regulator

An Analog Switching Regulator (ASR or ABUCK) is built in the Veda IF912 module, the ABUCK output is brought out to pin-33 and pin-34. A L-C filter (2.2uH and 4.7uF) is required to filter out the switching noise before it feeds into ABUCK_1P12 (pin-26 and pin-27). Keep the 2.2uH and 4.7uF as close to Veda IF913 as possible to keep the current flow loop small as you can. Please refer to the Ezurio DVK for the detail placement and routing. Detail parts information is shown in below.

• 2.2uH: 74479276222C  (Wurth Elektronik)
• 4.7uF: GRM188C71A475KE11#  (Murata)

Serial Memory Interface (SMIF) Connection.

For the Veda IF912 without embedded memory variant (453-00396R), user can add external memory (NOR Flash and PSRAM) to the SMIF. Example connections are shown below. Note: VDDIO is limited to 1.8V.

For the Veda IF912 with embedded memory variant (453-00397R), user need to connect SMIF to the embedded memory pin out (pin48/50; pin51 to pin-55). Example connections are shown below.

SDIO and gSPI strapping configuration

SDIO and gSPI in Veda IF912 are muxed together on the same pin out, please reference Pin Out / Package Layout .

A strapping option pin SDIO_DATA[2] is used to configure between SDIO and gSPI. Default is in “H” state which is SDIO mode. Pull this pin to “L” will be set in gSPI mode.

SDIO mode

Veda IF912 provide support for SDIO V 3.0, including the new UHS-I modes:

• DS: Default speed (DS) up to 25 MHz, including 1 and 4-bit modes (1.8 V signaling
• HS: High-speed up to 50 MHz (1.8 V signaling)
• SDR12: SDR up to 25 MHz (1.8 V signaling)
• SDR25: SDR up to 50 MHz (1.8 V signaling)
• SDR50: SDR up to 100 MHz (1.8 V signaling)
• DDR50: DDR up to 50 MHz (1.8 V signaling)

gSPI mode

Veda IF912 has the option of using the simplified generic SPI (gSPI) interface/protocol.

Characteristics of the gSPI mode include:

• Up to 50-MHz operation
• Fixed delays for responses and data from the device
• Alignment to host gSPI frames (16 or 32 bits)
• Up to 2-KB frame size per transfer
• Little-endian and big-endian configurations
• A configurable active edge for shifting
• Packet transfer for CCM/CP Traffic/Data Exchange

Surface Mount Conditions

The following soldering conditions are recommended to ensure device quality.

Recommended Stencil Aperture

TBD

Soldering

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)

Measuring point – IC package surface

Temperature profile:

• Solder paste alloy: SAC305(Sn96.5 / Ag3.0 / Cu 0.5)
• Pre-heat temperature: 150℃ ~ 200℃; Soak time: 60 second ~ 120 second
• Peak temperature: 235℃ ~ 250℃
• Time above 220℃: 40 second ~ 90 second
• Optimal cooling rate < 3℃/second
• The oxygen concentration < 2000 ppm

Application Note for Surface Mount Modules

Introduction

Shipping and Labeling

Reflow Parameters

Cautions when Removing the SIP from the Platform for RMA

• Bake the platform PCBA before removing the Veda IF912 module from the platform.
• Remove the Vedaa IF912 module by using a hot air gun. This process should be carried out by a skilled technician.

Recommended conditions for one-side component platform:

• Set the hot plate at 280°C.
• Put the platform on the hot plate for 8~10 seconds.
• Remove the device from platform.

Recommended conditions for two-side components platform:

• Use two hot air guns.
• On the bottom, use a pre-heated nozzle (temp setting of 200~250°C) at a suitable distance from the platform PCB.

• On the top, apply a remove nozzle (temp setting of 330°C). Heat until device can be removed from platform PCB.

  
• Remove the residue solder under the bottom side of device. (Note: Alternate module pictured as an example)

(Not accepted for RMA)	(Accepted for RMA analysis)

• Remove and clean the residue flux as needed.

Precautions for Use:

• Opening/handling/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment.
• The devices should be mounted within one year of the date of delivery.
• The Veda IF912 modules are MSL level 4 rated.

Environmental and Reliability

Environmental Requirements

Required Storage Conditions

Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

• Normal temperature: 5~40˚C
• Normal humidity: 80% (Relative humidity) or less
• Storage period: One year or less

After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

Storage conditions for one-time soldering:

• Temperature: 5-25°C
• Humidity: 60% or less
• Period: 72 hours or less after opening

Storage conditions for two-time soldering

Storage conditions following opening and prior to performing the 1^st reflow:

• Temperature: 5-25°C
• Humidity: 60% or less
• Period: A hours or less after opening

Storage conditions following completion of the 1^st reflow and prior to performing the 2^nd reflow

• Temperature: 5-25°C
• Humidity: 60% or less
• Period: B hours or less after completion of the 1st reflow

Temporary Storage Requirements after Opening

The following are temporary storage requirements after opening:

• Only re-store the devices once prior to soldering.
• Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing.

The following indicate the required storage period, temperature, and humidity for this temporary storage:

Storage temperature and humidity:

Storage period:

• X1+X2 – Refer to Material handling information
• Required Storage Conditions.  Keep is X1+X2 within 72 hours.
• Y – Keep within two weeks or less.

Baking Conditions

Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:

• The calculated shelf life in a sealed bag is 12 months at <40℃ and <80% relative humidity.
• Once the packaging is opened, the SiP must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30˚C and <60% relative humidity.

If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ˚C (±5 ˚C).

Regulatory, Qualification & Certifications

Regulatory Approvals

TBD

Bluetooth SIG Qualification

TBD

Certified Antennas

The Veda IF912 module was tested with antennas listed in the following table. The OEM can choose a different manufacturer’s antenna but must make sure it is of same type and that the gain is less than or equal to the antenna that is approved for use.

Ordering Information

Legacy - Revision History