Carbon AM62 OSM-MF SOM

Now available: Develop for touchscreen, vision, and more with our fully-featured Carbon AM62 Evaluation Kit! 

Our new Carbon AM62 OSM-MF family is powered by Texas Instrument’s AM625 and AM623 processor families, TI’s TPS65219 PMIC, optional Sona TI351 (TI CC3351) Wi-Fi and BLE wireless modules [and more wireless options], LPDDR4 RAM, and eMMC storage. The Carbon AM62 OSM-MF is designed to meet the processing and connectivity needs of the commercial, industrial, and medical products. Our flexible production options allow you to choose the RAM, eMMC storage, and Sona Wi-Fi and Bluetooth connectivity that is most optimized for your product. All Carbon AM62 OSM-MF modules come with our industry leading software and integration support.

• Powerful Heterogenous Multiprocessing: Four 1.4 GHz Cortex-A53 cores, a 400 MHz Cortex-M4F applications MCU core, an 400 MHz Cortex-R5F device management core, and a dual-core Programmable Real-Time Unit. Run Linux and multiple RTOSes simultaneously on dedicated cores.
• Dual Display with GPU: Support dual independent displays with resolutions up to 3840  x 1080, GPU with performance up to 8 GFLOPS
• Camera Support: MIPI-CSI with virtual channel support
• Offered standard with Sona TI351 Wi-Fi 6 and Bluetooth Low Energy 5.4: Optional wireless based on TI CC3351. Additionally, choose from our Sona IF513, Sona IF573, Sona NX611, and 60 Series radios. 
• High Speed Interfaces: USB 2.0 (480 Mbps) and dual Gigabit Ethernet (1 Gbps) 
• Industrial Interfaces: UART, SPI, I2C, I2S, CAN-FD, GPIO, and more
• Software and Board Support Options: Yocto Linux/Buildroot Linux/Debian (QNX on request) for Cortex-A53s, FreeRTOS for Cortex-M4F and Cortex-R5F
• Secure and Encrypted Boot, Secure Enclave, and Secure File Storage: Robust, secure, and encrypted boot mechanisms to ensure only trusted software boots on your device. Store and use secure keys, certificates, and credentials in run-time isolated trusted environment.
• OSM-MF v1.2 Standard Form Factor: 45mm x 30mm OSM-MF solder down form factor ensures one carrier design can support multiple processor, memory, and wireless configurations.
• Hardware Upgrade Roadmap: Build a product design that can easily be upgraded to the latest processors and wireless options as future Ezurio SOMs based on the OSM standard are released. 
• Advanced Common Carrier/Development Board: Display, camera, audio, Ethernet, USB, PCI-Express, CAN, I2C, SPI, UART, power measurement, and more. Use in development and as reference designs for your carrier board design.