Vela IF820 Series

Scope

This document describes the key hardware aspects of the Ezurio Vela IF820 Series wireless modules providing high-speed 4-wire UART interface for Bluetooth® / Bluetooth® LE connections. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources and includes information found in the Infineon CYW20820 data sheet issued on September 26, 2022, along with other documents provided by Infineon.

Note: The information in this document is subject to change. Please contact Ezurio to obtain the most recent version of this document.

Introduction

Overview

This document describes key hardware aspects of the Vela IF820. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources. For full documentation on the Vela IF820, visit:

https://www.ezurio.com/vela-if820

General Description

Ensure your estate of Classic Bluetooth devices don't get left behind in a growing environment of Bluetooth LE-only wireless options. Our Vela IF820 series being dual mode allows a single module to cover legacy Classic Bluetooth and migration to Bluetooth LE with a single part. This innovative series is based on Infineon Technologies AIROC™ CYW20820 silicon. This range of flexible modules, adapters and DVKs marries all the benefits of the CYW20820 hardware, software, and tools offerings with our added value application software, services, certification, and support capabilities. The Vela IF820 series provides OEMs with multiple software development options suited to their resources and skillsets, with close attention to providing forward-looking replacement products for some of Ezurio's legacy Bluetooth product portfolio.

The Vela IF820 includes multiple small form factor PCB modules to suit any host board footprint and targets both hosted and hostless applications. They're accompanied by low cost, easy to use development kits and the addition of a certified, packaged USB Adapter to add Classic Bluetooth and Bluetooth LE connectivity to a variety of additional products in your Bluetooth portfolio. Together, Infineon and Ezurio drive down your total cost of ownership, design complexity and risk, while ensuring you the fastest time to market for your next dual mode Bluetooth IoT design.

This datasheet is subject to change. Please contact Ezurio for further information.

Features & Benefits

The Ezurio Vela IF820 series device features are described in the following table.

Specification Summary

Processor / SoC / Chipset

Bluetooth

Radio Performance

Interfaces

Power

Mechanical

Software

Environmental

Certifications

Development

Warranty

All specifications are subject to change without notice.

Functional Descriptions

Bluetooth Functional Description

The Vela IF820 is a dual mode Bluetooth module based on the Infineon Technologies AIROC™ CYW20820 silicon, supporting both Classic Bluetooth (BR/EDR) and Bluetooth LE. It connects to the host system via a high-speed 4-wire HCI UART interface. Multiple software development options are available including EZ Serial firmware and HCI firmware.

Programming & Firmware

Vela IF820 firmware programming is done via the HCI UART. There are two tools to flash a Vela IF820 module, detailed at the following link:

https://github.com/LairdCP/Vela_IF820_Firmware/releases

if820_flasher_gui is a graphical user interface for flashing Vela IF820 DVKs and dongles; it will auto detect any Vela IF820 DVKs and dongles currently connected to your PC. It cannot be used for flashing a loose module.if820_flasher_cli is a command line tool for flashing Vela IF820 DVK, dongle and loose modules. Like the GUI it will auto detect a DVK or dongle but you can also specify a com port for a loose module. When specifying a com port the Flasher CLI bypasses the DVK probe auto detect. You can use the -c option in the IF820 Flasher GUI to specify a com port.

When flashing a loose module via a particular com port the following should be noted:

• Flashing uses BT_UART_TXD, BT_UART_RXD, BT_UART_CTS, BT_UART_RTS
• Flow control is mandatory.
• Reset line is also required to be able to enter programming mode.
• UART settings are 115200 8N1
• CTS needs to be low during a reset to enter programming mode.
• The GUI can only be used to flash DVKs and dongles. You must use the CLI for loose modules.

Interfaces

UART

The Vela IF820 uses a high-speed HCI UART interface. The following signals are required for all firmware flashing operations: BT_UART_TXD, BT_UART_RXD, BT_UART_CTS, BT_UART_RTS. Flow control is mandatory. See Host Interface Specifications for timing details.

SPI

Two Quad-SPI interfaces are available. See Host Interface Specifications for SPI timing details.

I2C

I2C interface supporting up to 1 MHz. See Host Interface Specifications for I2C timing details.

GPIO

Up to 22 GPIOs are available. GPIO lines can be remapped using the Supermux I/O functions. See MHF4 Connector Variant Footprint and Pin Definitions and Integrated Antenna Variant Footprint and Pin Definitions for pin details and Supermux function tables.

ADC

Auxiliary ADC with up to 28 analog channels.

nRESET Pin

RST is an active-low system reset with internal pull-up resistor. Required for flashing EZ Serial and HCI firmware. CTS needs to be low during a reset to enter programming mode.

RF

The following is a list of RF layout design guidelines and recommendations when installing an Ezurio radio into your device.

• Do not run antenna cables directly above or directly below the radio.
• Do not place any parts or run any high-speed digital lines below the radio.
• If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between these two antennas.
• Ensure that there is the maximum allowable spacing separating the antenna connectors on the Ezurio radio from the antenna. In addition, do not place antennas directly above or directly below the radio.
• Ezurio recommends the use of a double-shielded cable for the connection between the radio and the antenna elements.
• Be sure to put a 100nF capacitor on EACH power pin. Also, place that capacitor to the pin as close as possible to make sure the internal PMU working correctly.
• Use proper electro-static-discharge (ESD) procedures when installing the Ezurio radio module. To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic objects or components.

Hardware Architecture

Block Diagrams

Pin-Out / Package Layout

MHF4 Connector Variant Footprint and Pin Definitions

Note: The following footprint and pin definitions apply to the Vela IF820. There are two module footprints, depending on which variant of the module is used. It is important to ensure you are using the correct version on your design.

MHF4 Connector Variant Mechanical Definition

Module dimensions of MHF4 connector variant module is 7.5 x 7.5 x 2.15 mm.

MHF4 Connector Variant Module Footprint

MHF4 Connector Variant Module Pin Definition

Reference Schematic Design (MHF4 Variant)

Note: It is recommended to put a 100nF bypass capacitor in the 3P0V (pin 31) and VDDIO (pin 10). Highly recommend placing external 32.768 kHz crystal. Using the external crystal guarantees the lowest power and highest timing accuracy. BT_UART signals (x4) are required for flashing EZ-Serial and HCI firmware.

Supermux I/O Function Defined Table

Integrated Antenna Variant Footprint and Pin Definitions

Integrated Antenna Variant Mechanical Definition

Module dimensions of integrated antenna variant module is 12.5 x 9.3 x 2.15 mm.

Integrated Antenna Variant Module Footprint

Integrated Antenna Variant Module Pin Definition

Reference Schematic Design (Integrated Antenna Variant)

Note: It is recommended to put bypass capacitors 100nF in the 3P0V (pin 22) and VDDIO (pin 2). Highly recommend to implement 32.768 kHz crystal (pin 4, pin 5). Using the external crystal guarantees the lowest power and highest timing accuracy. BT_UART signals (x4) are required for flashing EZ-Serial and HCI firmware.

Mechanical Drawings

See pin definition sections above for mechanical details per variant. Images referenced above (Figures 9, 12) include detailed mechanical drawings.

Host Interface Specifications

High-Speed UART Specifications

SPI Timing

SPI mode 0 and 2

SPI mode 1 and 3

I2C Timing

Notes:

1. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2. Time that the CBUS must be free before a new transaction can start.

I2S Timing

Notes:

3. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver must be able to handle the data transfer rate.
4. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio. For this reason, tHC and tLC are specified with respect to T.
5. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that they can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the requirements can be used.
6. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore, the transmitter must guarantee that thtr is greater than or equal to zero, so long as the clock rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr.

Electrical Characteristics

Absolute Maximum Ratings

Table 4 summarizes the absolute maximum ratings and Table 5 lists the recommended operating conditions for the Vela IF820 series wireless module. Absolute maximum ratings are those values beyond which damage to the device can occur. Operating this device outside of the listed maximum ratings and operating conditions may damage the device and void the warranty.

Note: Maximum rating for signals follows the supply domain of the signals.

Recommended Operating Conditions

DC Electrical Characteristics

The following lists the general DC electrical characteristics over recommended operating conditions (unless otherwise specified).

General Current Consumption

See Bluetooth Current Consumption for current consumption values by operating mode.

Signal Levels and Interface Specs

See Host Interface Specifications for UART, SPI, I2C, and I2S signal level specifications.

Radio Characteristics

Bluetooth Receiver Characteristics

Basic Rate (BR) receiver performance (3V)

Enhanced Data Rate (EDR) receiver performance (3V)

Bluetooth LE RF Specifications (3V)

Note: Dirty TX is Off.

Bluetooth Transmitter Characteristics

Basic Rate (BR) transmitter performance at 25°C (3V)

Bluetooth LE TX Power

Note: The Bluetooth LE TX power cannot exceed 10 dBm EIRP specification limit. The front-end losses and antenna gain/loss must be factored in so as not to exceed the limit.

Bluetooth Current Consumption

Bluetooth current consumption, VBAT=3V VDDIO=3V, MHF4 connector variant

Bluetooth current consumption, VBAT=3V VDDIO=3V, Integrated antenna variant

Note: Current consumption is measured at average of the TX-on time.

Power Management & Consumption

Power Consumption

See Bluetooth Current Consumption for typical current consumption values by operating mode.

Integration Guidelines

Antenna Characteristics

453-00171 Integrated Chip Antenna Performance

The following are details and plots of the measured radiation performance of the chip antenna on the Vela IF820 module with integrated antenna (part numbers 453-00171R and 453-00171C).

Summary of Antenna Performance

Note: The result is measured with Ezurio DVK part # 453-00171-K1.

453-00185 USB Adapter Integrated Antenna Performance

The following are details and plots of the measured radiation performance of the integrated antenna on the Vela IF820 USB adapter (part number 453-00185).

Summary of Antenna Performance

Note: The result is measured with USB adapter (part # 450-00185).

Circuit (Overview and Checklist)

See reference schematic designs in MHF4 Connector Variant Footprint and Pin Definitions and Integrated Antenna Variant Footprint and Pin Definitions.

PCB Layout

PCB Layout on Host PCB - General

• Do not run antenna cables directly above or directly below the radio.
• Do not place any parts or run any high-speed digital lines below the radio.
• If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between these two antennas.
• Ensure that there is the maximum allowable spacing separating the antenna connectors on the Ezurio radio from the antenna. In addition, do not place antennas directly above or directly below the radio.
• Ezurio recommends the use of a double-shielded cable for the connection between the radio and the antenna elements.
• Be sure to put a 100nF capacitor on EACH power pin. Also, place that capacitor to the pin as close as possible to make sure the internal PMU working correctly.

Layout Recommendations for Integrated Antenna Variant:

1. Align module edge with PCB edge.
2. To maintain antenna radiation efficiency, keep at least 15mm width of the GND plane to the sides of the module.

Antenna Keep-Out on Host PCB

For the integrated antenna variant, ensure the module is placed at the edge of the PCB and that there is adequate clearance around the antenna area. See layout diagrams (Figure 15) for reference.

External Antenna Integration

Refer to the regulatory sections for details on use of the Vela IF820 with external antennas in each regulatory region. See Certified Antennas for the list of certified external antennas.

Application Note for Surface Mount Modules

Introduction

Ezurio's surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the user manual. This application note is considered a living document and will be updated as new information is presented.

The modules are designed to meet the needs of several commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.

Vela IF820 part numbers 453-00171R and 453-00172R are shipped as Tape / Reel, with a reel containing 1,000 pcs.

Module Packaging Configuration

Reflow Parameters

The following soldering conditions are recommended to ensure device quality.

Note: When soldering, the stencil thickness should be ≥ 0.1 mm.

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment):

• Measuring point — IC package surface
• Ramp-up: 40–130°C. Less than 2.5°C/sec
• Pre heat: 130–180°C 60–120 sec, 180°C MAX
• Ramp-up: 180–220°C. Less than 3°C/sec
• Peak Temperature: MAX 250°C — 225°C ~ 250°C, 30 ~ 50 sec
• Ramp-down: Less than 3°C/sec

Soldering Profile / Baking Conditions

Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:

• The calculated shelf life in a sealed bag is 12 months at <40°C and <80% relative humidity.
• Once the packaging is opened, the SiP must be mounted (per MSL 4 / Moisture Sensitivity Level 4) within 72 hours at <30°C and <60% relative humidity.
• If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125°C (±5°C).

Cautions when Removing the SIP from the Platform for RMA

• Bake the platform before removing the SIP from the platform. Reference baking conditions.
• Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.

Suggestion conditions:

• One-side component platform: Set the hot plate at 280°C. Put the platform on the hot plate for 8~10 seconds. Remove the SIP from platform.
  

  

• Two-side components platform: Use two hot air guns. On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable distance from the platform PCB. On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be removed from platform PCB.
  

  

• Remove the residue solder under the bottom side of SIP (alternate module pictured as an example).

  
• Remove and clean the residue flux as needed.

Precautions for Use

• Opening/handling/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment.
• The devices should be mounted within one year of the date of delivery.
• The Vela IF820 modules are MSL 4 rated.

Shipping and Labeling

Packaging

All modules are shipped in tape and reel package and sealed in ESD Bags. Vela IF820 part numbers 453-00171R and 453-00172R are shipped as Tape / Reel, with a reel containing 1,000 pcs.

Labeling

The following labels are placed on the anti-static bag. The Vela IF820 solder-down modules are classified as MSL4 devices.

The following labels are placed on the pizza box.

The following labels are placed on the master shipping carton.

Required Storage Conditions

Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

• Normal temperature: 5~40°C
• Normal humidity: 80% (Relative humidity) or less
• Storage period: One year or less

Note: Humidity means relative humidity.

After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

• Storage conditions for one-time soldering:

  • Temperature: 5–25°C
  • Humidity: 60% or less
  • Period: 72 hours or less after opening

• Storage conditions for two-time soldering:

  • Storage conditions following opening and prior to performing the 1st reflow:

    • Temperature: 5–25°C
    • Humidity: 60% or less
    • Period: A hours or less after opening

  • Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow:

    • Temperature: 5–25°C
    • Humidity: 60% or less
    • Period: B hours or less after completion of the 1st reflow

Note: Should keep A+B within 72 hours.

Temporary Storage Requirements after Opening

• Only re-store the devices once prior to soldering.
• Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing.

• Storage period X1+X2 — refer to After Opening the Dry Packing storage requirements. Keep X1+X2 within 72 hours.

  

  *** - External atmosphere temperature and humidity of the dry packing

• Storage period Y — keep within two weeks or less.

Environmental and Reliability

Reliability Tests

Environmental and Mechanical

Climatic and Dynamic

Reliability Prediction

Regulatory, Qualification & Certifications

Regulatory Approvals

Full regulatory information on the Vela IF820, including the Regulatory Information Guide, grants, and test reports are available on the Vela IF820 product page (coming soon).

The Vela IF820 holds current certifications in the following countries:

Certified Antennas

Bluetooth SIG Qualification

The Bluetooth Qualification Process promotes global product interoperability and reinforces the strength of the Bluetooth® brand and ecosystem to the benefit of all Bluetooth SIG members. The Bluetooth Qualification Process helps member companies ensure their products that incorporate Bluetooth technology comply with the Bluetooth Patent & Copyright License Agreement and the Bluetooth Trademark License Agreement (collectively, the Bluetooth License Agreement) and Bluetooth Specifications.

The Bluetooth Qualification Process is defined by the Qualification Program Reference Document (QPRD) v3.

To demonstrate that a product complies with the Bluetooth Specification(s), each member must for each of its products:

• Identify the product, the design included in the product, the Bluetooth Specifications that the design implements, and the features of each implemented specification
• Complete the Bluetooth Qualification Process by submitting the required documentation for the product under a user account belonging to your company

To complete the Qualification Process the company developing a Bluetooth End Product shall be a member of the Bluetooth SIG. To start the application please use the following link: Apply for Adopter Membership

Scope

This guide is intended to provide guidance on the Bluetooth Qualification Process for End Products that reference multiple existing designs, that have not been modified (refer to Section 3.2.2.1 of the Qualification Program Reference Document v3).

For a Product that includes a new Design created by combining two or more unmodified designs that have DNs or QDIDs into one of the permitted combinations in Table 3.1 of the QPRDv3, a Member must also provide the following information:

• DNs or QDIDs for Designs included in the new Design
• The desired Core Configuration of the new Design (if applicable, see Table 3.1 below)
• The active TCRL Package version used for checking the applicable Core Configuration (including transport compatibility) and evaluating test requirements

Any included Design must not implement any Layers using withdrawn specification(s). For the purposes of this document, it is assumed that the member is combining unmodified Core-Controller Configuration and Core-Host Configuration designs, to complete a Core-Complete Configuration.

Qualification Steps

For this qualification option, follow these steps:

1. To start a listing, go to: https://qualification.bluetooth.com/
2. Select Start the Bluetooth Qualification Process.
3. Product Details to be entered: Project Name (this can be the product name or the Bluetooth Design name), Product Description, Model Number, Product Publication Date (the product publication date may not be later than 90 days after submission), Product Website (optional), Internal Visibility (this will define if the product will be visible to other users prior to publication). If you have multiple End Products to list then you can select 'Import Multiple Products', firstly downloading and completing the template, then by 'Upload Product List'. This will populate Qualification Workspace with all your products.

4. Specify the Design:

   • Do you include any existing Design(s) in your Product? Answer Yes, I do.
   • Enter the multiple DNs or QDIDs used in your design (for Option 2a two or more DNs or QDIDs must be referenced).
   • Select 'I'm finished entering DNs'.
   • Once the DNs or QDIDs are selected they will appear on the left-hand side, indicating the layers covered by the design (should show Core-Controller and Core Host Layers covered).
   • What do you want to do next? Answer, 'Combine unmodified Designs'.
   • The Qualification Workspace Tool will indicate that a new Design will be created and what type of Core-Complete configuration is selected.
   • An active TCRL will be selected for the design.
   • Perform the Consistency Check, which should result in no inconsistencies. If there are any inconsistencies these will need to be resolved before proceeding.
   • Save and go to Test Plan and Documentation.
5. Test Plan and Documentation: As no modifications have been made to the combined designs the tool should report the following message: 'No test plan has been generated for your new Design. Test declarations and test reports do not need to be submitted. You can continue to the next step.' Save and go to Product Qualification fee.
6. Product Qualification Fee: Ensure a Prepaid Product Qualification fee is available as it is required at this stage to complete the Qualification Process. Prepaid Product Qualification Fees will appear in the available list so select one for the listing. If one is not available select 'Pay Product Qualification Fee'; payment can be done immediately via credit card, or you can pay via Invoice. Payment via credit card will release the number immediately; if paying via invoice the number will not be released until the invoice is paid. Once you have selected the Prepaid Qualification Fee, select 'Save and go to Submission'.

7. Submission:

   • Some automatic checks occur to ensure all submission requirements are complete.
   • To complete the listing any errors must be corrected.
   • Once you have confirmed all design information is correct, tick all of the three check boxes and add your name to the signature page.
   • Now select 'Complete the Submission'.
   • You will be asked a final time to confirm you want to proceed with the submission, select 'Complete the Submission'.
   • Qualification Workspace will confirm the submission has been submitted. The Bluetooth SIG will email confirmation once the submission has been accepted (normally this takes 1 working day).
8. Download Product and Design Details (SDoC): You can now download a copy of the confirmed listing from the design listing page and save a copy in your Compliance Folder.

For further information, please refer to the following webpage: https://www.bluetooth.com/develop-with-bluetooth/qualification-listing/

Example Design Combinations

Qualify More Products

If you develop further products based on the same design in the future, it is possible to add them free of charge. The new product must not modify the existing design (i.e. add ICS functionality), otherwise a new design listing will be required.

To add more products to your design, select 'Manage Submitted Products' in the Getting Started page, Actions, Qualify More Products. The tool will take you through the updating process.

Ordering Information

This is a preliminary datasheet. Please check with Ezurio for the latest information before commencing a design. If in doubt, ask. For additional information visit the Vela IF820 product page.

Additional Support & Appendices

Please contact your local sales representative or our support team for further assistance:

Note: Information contained in this document is subject to change. Ezurio's products are subject to standard Terms & Conditions. © Copyright 2026 Ezurio All Rights Reserved. Any information furnished by Ezurio and its agents is believed to be accurate but cannot be guaranteed. All specifications are subject to change without notice. Responsibility for the use and application of Ezurio materials or products rests with the end user since Ezurio and its agents cannot be aware of all potential uses. Ezurio makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Ezurio materials or products for any specific or general uses. Ezurio or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Ezurio products are sold pursuant to the Ezurio Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. Nothing herein provides a license under any Ezurio or any third-party intellectual property right. Ezurio and its associated logos are trademarks owned by Ezurio and/or its affiliates.

Legacy - Revision History