Contents: Interposer board, Carbon AM62-OSM-MF, No Wireless, FlexPIFA 6E, Heatsink

Specifications

Connectivity

Antenna Connector Type
None
Chipset (Wireless)
None

Processing

Chipset
TI Sitara AM625

Features

Memory
2 GB
Storage
16 GB
Additional Description
Carbon AM62 OSM-MF SOM on interposer board (For Use with Generic OSM EVK)

Environment

Operating Temp (Min) (°C)
-40 °C
Operating Temp (Max) (°C)
+85 °C

Packaging

Packaging
Single

Documentation

Browse Datasheets, Documentation, Product Briefs and Technical Drawings in our Support & Documentation Center.

Browse EZOMI-625-0216-00000-2-IK Documentation

Distributors

Sorry, no inventory of this part found at this time. Please contact us to purchase.