Sona TI351

Scope

This document describes key hardware aspects of the Ezurio Sona™ TI351 series wireless modules providing a SDIO 2.0 interface for WLAN connection and a high-speed 4-wire UART interface for Bluetooth Low Energy (BLE)^® connection.  This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices.

Introduction

General Description

The Sona TI351 series wireless module is an integrated, small form factor Wi-Fi/Bluetooth module that is optimized for low-power mobile devices, featuring:

• Wi-Fi 6:  Dual-band 1x1 IEEE 802.11a/b/g/n/ax WLAN
• Bluetooth^® 5.4:  BLE

The integration of all WLAN and Bluetooth functionality in a single package supports a low cost and simple implementation along with flexibility for platform-specific customization.  The radio is pre-calibrated and integrates the complete transmit/receive RF paths including bandpass filter, diplexer, switches, reference crystal oscillator, and power management units (PMU).  It is available in both M.2 2230 E-Key and M.2 1216 solder-down form factors with an MHF4 antenna connector.  The M.2 1216 module is also available with an integrated chip antenna variant.  For a list of certified antennas see Table 31 in this datasheet.

The Sona TI351 series device supports IEEE 802.11ax dual-band (2.4/5 GHz) single streams with data rates up to MCS7 (86 Mbps PHY data rate for 2.4/5 GHz).  The fully integrated Wi-Fi and Bluetooth radios includes full digital MAC and baseband engines that handle all 802.11 CCK/OFDM/OFDMA® 2.4/5 GHz and Bluetooth Low Energy 5.4 baseband and protocol processing.

Ordering information is listed in Table 1.  Please contact Ezurio Sales/FAE for further information.

This datasheet is subject to change. Please contact Ezurio for further information.

Features & Benefits

The Sona TI351 device features and benefits are described in the following table.

Specification Summary

Processor / SoC / Chipset

Wi-Fi

Bluetooth

Radio Performance

Interfaces

Power

Mechanical

Software

Environmental

Certifications

Warranty

Functional Descriptions

WLAN Functional Description

The Sona TI351 series wireless module is designed using the Texas Instruments CC3351ENJARSBR Wi-Fi 6 chipset. It is optimized for high speed, reliability, and low-power embedded applications. It is integrated with dual-band WLAN (2.4/5 GHz) and Bluetooth 5.4 (Low Energy).

Bluetooth Functional Description

The Sona TI351 series wireless module includes a fully integrated Bluetooth baseband/radio. Several features and functions are listed below.

Coexistence Feature

Three coexistence lines are available to provide a means to organize wireless packet traffic for communication protocols operating in the same frequency band.  When implemented, the Sona TI351 behaves as the COEX primary device to communicate to a COEX secondary device using a three-wire Packet Traffic Arbitration (PTA) interface.  The coexistence signals on the TI351 are:

• COEX_GRANT:  An output signal, controlled by the TI351 indicating the response of the PTA decision.
• COEX_PRIORITY:  An input signal, controlled by the secondary device indicating the priority of a request signal.
• COEX_REQ:  An input signal, controlled by the secondary device indicating a request to use the shared frequency band.

Power-Up Sequence

For proper operation of the Sona TI351, meet the following power-up sequence requirements.

M.2 1216 modules (453-00199 and 453-00200)

• Both module supply inputs (3.3V and VIO_1.8V) must be available and stabilized before W_DISABLE1#/nRESET line is released.
• If using an external slow clock, ensure that the clock operation is stable before W_DISABLE1#/nRESET  is released (set high).
• The W_DISABLE1#/nRESET line is held low for at least 10µs after inputs are stabilized.
• The SDIO_WAKE#/HOST_IRQ_WL line on the M.2 1216 module is sensed by the module on power up.  The pin is pulled low internally and must remain low when the device powers up.  When this pin is connected to a host device, ensure that the line stays at a logic low level during module power-up and is not pulled high or driven high by the host platform.  Some host implementations may require a buffer device to be placed between the SDIO_WAKE#/HOST_IRQ_WL module pin and the MCU GPIO pin used depending on how the MCU configures the GPIO on power up.

M.2 2230 module (453-00209)

• The module 3.3V supply input must be stable and allow at least 1ms for the module 1.8V power supply, slow clock, and level shifters to stabilize before W_DISABLE1# line is released.
• The W_DISABLE1# line is held low for at least 10µs after inputs are stabilized.

Hardware Architecture

Block Diagrams

M.2 1216 Solder-Down LGA w/MHF4 connector

M.2 1216 Solder-Down LGA w/Chip Antenna

M.2 2230 Key-E card

Pin-Out / Package Layout

Sona TI351 1216 MHF4 module Pin Assignments

Sona TI351 1216 Chip Antenna Pin Assignments

Sona TI351 M.2 2230 module Pin Assignments

Mechanical Drawings

Module Footprints

M.2 1216 MHF4 Connector (453-00199)

M.2 1216 Chip Antenna PCB Footprint (453-00200)

Module Dimensions

M.2 1216 Dimensions

M.2 2230 Key-E (453-00209)

The dimensions of Sona TI351 M.2 2230 E-Key module are 22 x 30 x 2.55 mm.

Host Interface Specifications

SDIO Specifications

The Sona TI351 module SDIO host signals are the interface for WLAN and must be 1.8V at all times as defined by the M.2 standard.  

Default Mode

High Speed Mode

SDIO timing requirements

UART Interface Specifications

The Sona TI351 series 4-wire UART is the main host interface for BLE access through the host controller interface (HCI) transport layer.

When using the UART interface with a host, take care to connect the lines correctly.  The signal names as listed in the Pin Assignment Tables of Pin Out / Package Layout are with respect to the TI351 module.

• UART_TXD must be connected to host side UART_RXD
• UART_RXD must be connected to host side UART_TXD
• UART_CTS must be connected to host side UART_RTS
• UART_RTS must be connected to host side UART_CTS

UART timing specifications

Electrical Characteristics

Absolute Maximum Ratings

Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended.

Recommended Operating Conditions

DC Electrical Characteristics / Current Consumption

The following table lists the general DC electrical characteristics over recommended operating conditions (unless otherwise specified).

General DC electrical characteristics (For 1.8V operation VDDIO)

The following table lists the nominal device current consumption at room temperature.

Low power current consumption

Radio Characteristics

WLAN Radio Receiver Characteristics

The following tables summarize the Sona TI351 series wireless module receiver characteristics.

Typical WLAN receiver characteristics for 2.4 GHz single chain operation, room temperature

Typical WLAN receiver characteristics for 5 GHz single chain operation, room temperature

WLAN Transmitter Characteristics

The following tables summarize the Sona TI351 series wireless module WLAN transmitter characteristics at room temperature.

WLAN transmitter characteristics for 2.4 GHz operation (VPA = 3.3V, VDDIO = 1.8V)

M.2 1216 module WLAN transmitter current consumption at 2.4 GHz (VPA= 3.3V, VDDIO = 1.8V) – at maximum TX power setting

M.2 2230 module WLAN transmitter current consumption at 2.4 GHz (VDD = 3.3V) – at maximum TX power setting

WLAN transmitter characteristics for 5 GHz operation (VBAT=3.3V, VDDIO=1.8V)

M.2 1216 module WLAN transmitter current consumption at 5 GHz (VPA= 3.3V, VDDIO = 1.8V) – at maximum TX power setting

M.2 2230 module WLAN transmitter current consumption at 5 GHz (VDD = 3.3V) – at maximum TX power setting

Bluetooth Transmitter Characteristics

The following tables describe the performance of the Bluetooth Low Energy transmitter and receiver and the current consumption at 25°C.

BLE RF Specifications (VPA = 3.3V, VDDIO = 1.8V)

M.2 1216 modules BLE radio current consumption (VPA = 3.3V, VDDIO = 1.8V)

M.2 2230 module BLE radio current consumption (VDD = 3.3V)

Slow Clock Oscillator Requirements

The Sona TI351 modules use a slow clock running at 32.768 kHz for low power modes.  On the M.2 1216 modules the slow clock can be generated internally or supplied externally.  The internal oscillator is less accurate and consumes more power than sourcing the slow clock externally.  When using the internal slow clock oscillator, leave the SUSCLK/SLOW_CLK_IN pin (Pin 27) unconnected.

An external clock source must meet the requirements listed in Table 24.  This clock should be fed to the SUSCLK/SLOW_CLK_IN pin (Pin 27).  The clock operation needs to be stable before the W_DISABLE1#/nRESET line is de-asserted to enable the device.

External Slow Clock Requirements (453-00199 and 453-00200 modules)

Integration Guidelines

The following is a list of RF layout design guidelines and recommendations when installing an Ezurio radio into your device.

• Do not run any antenna cables directly above or directly below the radio.
• Do not place any parts or run any high-speed digital lines below the radio.
• Ensure that there is the maximum allowable spacing separating the antenna connectors on the Ezurio radio from the antenna.  In addition, do not place antennas directly above or directly below the radio.
• Ezurio recommends the use of a double-shielded cable for the connection between the radio and the antenna elements.
• Be sure to put a 10uF/16V/0603 capacitor on EACH 3.3V power pin.  Also, place that capacitor as close as possible to the pin to make sure the internal PMU is working correctly.
• Use proper electro-static-discharge (ESD) procedures when installing the Ezurio radio module.  To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic objects or components.

Sona TI351 Integrated Antenna Guidelines

The Sona TI351 integrated antenna variant (453-00200) has specific placement and layout design guidelines that must be followed. 

• The Sona TI351 Integrated antenna variant MUST BE located at the edge of the Host PCB and surrounded by ground on three sides.  
• The antenna keep out region as defined in Figure 14 must be kept clear of copper on all layers of the host PCB. 
• Extending the ground on the Host PCB ≥ 15mm from the module edge in each direction will optimize antenna performance.

Antenna Keep-Out on Host PCB

Surface Mount Conditions

The following soldering conditions are recommended to ensure device quality.

Soldering

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)

Measuring point – IC package surface

Temperature profile:

• Solder paste alloy: SAC305(Sn96.5 / Ag3.0 / Cu 0.5)
• Pre-heat temperature: 150℃ ~ 200℃; Soak time: 60 second ~ 120 second
• Peak temperature: 235℃ ~ 250℃
• Time above 220℃: 40 second ~ 90 second
• Optimal cooling rate < 3℃/second
• The oxygen concentration < 2000 ppm

M.2 2230 Key-E Mounting

The Sona TI351 M.2 2230 module connects to the host via a standard PCI EXPRESS M2 connector.  The Kyocera (www.Kyocera-connector.com) 6411 series provides 1.8 mm, 2.3 mm and 3.2 mm connector heights and the JAE (https://www.jae.com/en/ ) SM3 series provides 1.2 mm, 2.15 mm, 3.1 mm and 4.1 mm connector heights. 

Because the Sona TI351 M.2 2230 module is a single-side component module, we recommend the following part numbers which have 2.3 mm and 3.1 mm connector height: 

The stand-off mating to the recommend 2.3 mm connector from EMI STOP (www.EMISTOP.com) is part number F50M16-041525P1D4M and 3.1mm from JAE (https://www.jae.com/en/ ) is part number SM3ZS067U310-NUT1-Rxxxx.

Detailed layout and stencil opening are shown as follows.

Application Note for Surface Mount Modules

Introduction

Ezurio’s surface mount modules are designed to conform to all major manufacturing guidelines.  This application note is intended to provide additional guidance beyond the information that is presented in the user manual.  This application note is considered a living document and will be updated as new information is presented.

The modules are designed to meet the needs of several commercial and industrial applications.  They are easy to manufacture and conform to current automated manufacturing processes.

Shipping and Labeling

M.2 1216 Solder-Down

There are 1000 Sona TI351 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5,000 modules per carton).  Reel, boxes, and carton are labeled with the appropriate labels.

The following labels are located on the antistatic bag.

The following label is placed on the reel, bag and pizza box.

The following package label is located on adjacent sides of the master carton.

M.2 2230 Key-E Card

The following label is placed on the bag and the inner box.

The following label is located on the adjacent sides of the master carton.

Reflow Parameters

Cautions when Removing the SIP from the Platform for RMA

• Bake the platform before removing the Sona TI351 module from the platform.  Reference baking conditions.
• Remove the Sona TI351 module by using a hot air gun.  This process should be carried out by a skilled technician.

Recommended conditions:

• One-side component platform:

  • Set the hot plate at 280°C.
  • Put the platform on the hot plate for 8~10 seconds.

  • Remove the device from platform.
    

    

• Two-side components platform:

  • Use two hot air guns.
  • On the bottom, use a pre-heated nozzle (temp setting of 200~250°C) at a suitable distance from the platform PCB.

  • On the top, apply a remove nozzle (temp setting of 330°C). Heat until device can be removed from platform PCB.
    

    
  • 
• Remove the residue solder under the bottom side of device. (Note: Alternate module pictured as an example)
  

Not Accepted for RMA	Accepted for RMA Analysis

• Remove and clean the residue flux as needed.

Precautions for Use

• Opening/handling/removing must be done on an anti-ESD treated workbench.  All workers must also have undergone anti-ESD treatment.
• The devices should be mounted within one year of the date of delivery.
• The Sona TI351 1216 modules are MSL level 4 rated.

Environmental and Reliability

Environmental Requirements

Required Storage Conditions

Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

• Normal temperature: 5~40˚C
• Normal humidity: 80% (Relative humidity) or less
• Storage period: One year or less

After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

• Storage conditions for one-time soldering:

  • Temperature: 5-25°C
  • Humidity: 60% or less
  • Period: 72 hours or less after opening

• Storage conditions for two-time soldering

  • Storage conditions following opening and prior to performing the 1^st reflow:

    • Temperature: 5-25°C
    • Humidity: 60% or less
    • Period: A hours or less after opening

  • Storage conditions following completion of the 1^st reflow and prior to performing the 2^nd reflow

    • Temperature: 5-25°C
    • Humidity: 60% or less
    • Period: B hours or less after completion of the 1^st reflow

Temporary Storage Requirements after Opening

The following are temporary storage requirements after opening:

• Only re-store the devices once prior to soldering.
• Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing.

The following indicate the required storage period, temperature, and humidity for this temporary storage:

Storage temperature and humidity:

*** - External atmosphere temperature and humidity of the dry packing

• Storage period:

  • X1+X2 – Refer to After Opening the Dry Packing storage requirements.  Keep is X1+X2 within 72 hours.
  • Y – Keep within two weeks or less.

Baking Conditions

Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:

• The calculated shelf life in a sealed bag is 12 months at <40℃ and <80% relative humidity.
• Once the packaging is opened, the SiP must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30˚C and <60% relative humidity.

If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ˚C (±5 ˚C).

Reliability Tests

The Sona TI351 modules were tested for reliability. Test items and the corresponding standards are shown in the following sections.

Environmental and Mechanical

The following are the reliability test procedures and results.

Sona TI351 M.2 1216 Solder-down Module Reliability Test Items and Standards

Sona TI351 M.2 2230 E-Key Module Reliability Test Item and Standards

Reliability Prediction

The predicted method refers to Telcordia SR-232 Issue 4 (2016)

Sona TI351 MTBF analysis

Regulatory, Qualification & Certifications

Regulatory Approvals

The Sona TI351 holds current certifications in the following countries (pending):

Sona TI351 Regulatory Certifications

Certified Antennas

The Sona TI351 MHF4 (453-00199) module was tested with the antennas listed in the following table.

Sona TI351 MHF4 external certified antenna list

Sona TI351 (453-00200) Chip Antenna Performance Characteristics

The TI351 Chip antenna module radiated performance depends on the host PCB layout.  The TI351 development board (453-00200-K1) was used for the chip antenna tuning and 453-00200 antenna performance evaluation.  To obtain similar performance, follow the guidelines presented in Section 14 RF Layout Guidelines for the chip antenna host PCB layout.

Sona TI351 Chip Antenna Radiated Performance

Test Setup

2442 MHz Radiated Performance

The patterns at other frequencies in the 2.4 GHz band exhibit the same radiated performance characteristics.

5500 MHz Radiated Performance

The patterns at other frequencies in the 5 GHz band exhibit the same radiated performance characteristics.

Ordering Information

Revision History (Legacy)

Additional Information

Please contact your local sales representative or our support team for further assistance:

Note:   Information contained in this document is subject to change.

 Ezurio’s products are subject to standard Terms & Conditions.