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Vendor Lock-In in SOM Selection
Why Ezurio built EZ BSP on open source foundations and what that means for your product roadmap
NXP
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The Engineer’s Guide to Security at the Edge with Ezurio & NXP
Building a modern, secure, and connected edge AI product is hard. Juggling components sourced from different vendors - application processors, wireless modules, NPUs - can lead to more time spent...
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Nitrogen95 + Vision EVK Overview
Designing for the edge demands flexibility, performance, and a platform that lets you move quickly from concept to prototype. The Nitrogen95 Evaluation Kit is built to do exactly that.
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Smarter, Faster, Connected: Platform Integration for Smart Building Edge Devices
Smart building devices must combine real-time control, wireless, and lifecycle management in compact, low-power form factors. This application study explores how a single platform approach addresses RF complexity, thermal constraints, and long-term software support at the edge.
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Introducing the Sona NX611 Series
Our Sona NX611 is our most form-factor diverse Wi-Fi 6E + Bluetooth 5.4 module available, based on the industry-leading NXP IW611 silicon.
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Next-Gen IoT with i.MX 91: Future-Proofing SOM Designs using SMARC & OSM
Discover the robust capabilities of the new i.MX 91 processor, a versatile, low-power solution tailored for next-generation applications.
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Now Available: The Nitrogen93 SMARC SOM
A SMARC® SOM with powerful processing using NXP i.MX 93 and Wi-Fi 6E Connectivity
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Introducing the Nitrogen8M Mini SMARC
Our new Nitrogen8M Mini SMARC is powered by NXP’s class-leading i.MX 8M Mini processor, NXP PMIC PF8121, and our Sona WiFi 6/6E and Bluetooth 5.3/5.4 wireless module.
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Unboxing the Summit SOM 8M Plus Development Kit
The Summit SOM 8M Plus is our most powerful SOM yet. It is powered by NXP’s innovative i.MX 8M Plus processor and 88W8997 wireless silicon coupled with onboard NXP PMICs (PCA9450CHN and PM823UK),...
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Episode 30: Introducing the Summit SOM 8M Plus
The Summit SOM 8M Plus is a high-performance, secure, and robust IoT SoM that’s rugged, has reliable connectivity, and is globally certified. It's powered by NXP’s innovative i.MX 8M Plus...
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Coming Soon: Summit SOM 8M Plus WiFi 5 + Bluetooth 5.3 System-on-Module
Highly integrated and comprehensive hardware and software solution. Combines NXP's i.MX 8M Plus processor and 88W8997 wireless SoC. We are pleased to introduce the newest addition to our...
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New System-on-Module from Laird Connectivity Delivers Powerful NXP Edge Processing with NXP Wi-Fi and Bluetooth
Akron, Ohio – November 2, 2021 – Laird Connectivity, a global leader in wireless technology, today announced the newest addition to their system-on-module (SOM) portfolio, the Summit SOM 8M...
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Integrating the LWB5+ Dongle - i.MX 8M Plus EVK - Yocto Environment
Learn how to integrate Ezurio's LWB5+ Dongle on an i.MX 8M Plus Yocto Platform. Step-by-step guide: https://github.com/LairdCP/LWB5plus-Tutorials/blob/main/docs/LWBplusDongle-imx8-yocto.md To...
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Episode 25: Introducing our Sterling 70 Series
Our new Sterling 70 series answers the call for next-generation Wi-Fi 6 (802.11ax) connectivity. Powered by NXP’s innovative 88W9098 silicon, the Sterling 70 is purpose-built for industrial IoT...
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Episode 24: Our Partnership with NXP
Ezurio’s Gold Partnership with NXP allows us to leverage NXP’s popular, secure connectivity solutions with the full suite of our engineering and manufacturing capabilities. Take NXP’s leading...
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Coming Soon: Sterling 70 Wi-Fi 6 + Bluetooth 5.1 Combo Module
We are proud to introduce our newest Wi-Fi module series, the Sterling 70 . Powered by the NXP 88W9098 wireless SOC, the Sterling 70 series is the industry’s first Wi-Fi 6 solution based on the...
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Come see Boundary Devices i.MX7 and i.MX6 Quad PLUS Demos at Embedded World
Come see Ezurio (formerly Boundary Devices)' recently announced Nitrogen7 and Nit6QP_MAX boards at Embedded World in the NXP booth. The Nitrogen7 is a multi-purpose i.MX7 single board...