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Unboxing the Vela IF310 Development Kit
Built on Infineon’s AIROC™ CYW55310, the Vela IF310 brings together Bluetooth Classic (BR/EDR) and is Bluetooth Core® 6.0 certified—including LE Audio with LC3, Isochronous Channels, Auracast,...
Infineon
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Unboxing the Veda IF91x Development Kit
Introducing a new Veda family of connected MCU from Ezurio, the Veda IF912 based upon the Infineon AIROC CYW55912, is a breakthrough low power solution that enables both SoC customizable modules and...
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Meet the Vela IF310 Bluetooth Classic & LE Audio Module
Refresh legacy Bluetooth designs and unlock Bluetooth Core 6.0 LE Audio in one rugged, ready module.
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The Unique Needs of IoT in Healthcare - A Chat with Infineon
Wi-Fi devices have unique challenges in healthcare environments, and Ezurio's modules are designed against those particular constraints. In this video, Infineon's Jerry Liu and Ezurio's Andy Ross...
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Upgrading a Connected Warehouse With Embedded Wi-Fi
By combining Infineon's proven AIROC wireless silicon with Ezurio's expertise in module design, OEMs can deliver more efficient equipment tailored to the decades long life cycles required in the industrial market.
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Smaller. Smarter. Stronger: Wireless Connectivity for Medical, Access Control, and Battery-Powered Devices
In this webinar, Ezurio and Infineon will demonstrate how you can replace two-chip systems with a secure, low-power module built for next-gen devices.
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Smaller. Smarter. Stronger: Wireless Connectivity for Medical, Access Control, and Battery-Powered Devices
In this webinar, Ezurio and Infineon will demonstrate how you can replace two-chip systems with a secure, low-power module built for next-gen devices.
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Achieving Best-in-Class RF Performance in Next-Gen Industrial and Medical Connected Applications
As the industrial and medical sectors adopt more advanced IoT solutions, the demand for robust and reliable wireless connectivity has never been higher. Next-generation wireless IoT devices in these...
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Now Available Nitrogen8M Plus with Sona IF573 Wi-Fi 6E + Bluetooth 5.4
A SMARC® SOM with powerful NXP edge processing based on the i.MX 8M Plus now with Wi-Fi 6E & Bluetooth 5.4
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Now Available: The Nitrogen93 SMARC SOM
A SMARC® SOM with powerful processing using NXP i.MX 93 and Wi-Fi 6E Connectivity
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Now Available: The Nitrogen8M Mini SMARC SOM
A SMARC SOM with powerful NXP edge processing now with Wi-Fi 6E & Bluetooth 5.4
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Now in Stock: Bluetooth 5.4 Dual-Mode Modules
The Vela IF820 delivers Classic Bluetooth and migration to Bluetooth LE with a single part. Based on Infineon Technologies AIROC CYW20820 silicon.
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Coming Soon: Vela IF820 Bluetooth 5 Dual Mode Modules
The Vela IF820 delivers Classic Bluetooth and migration to Bluetooth LE with a single part.
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Now Available: Nitrogen8M Plus SMARC® with Wi-Fi 5 + Bluetooth 5.2
A SMARC SOM with powerful NXP edge processing based on the i.MX 8M Plus.
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Coming Soon: Sterling-LWB+ M.2 Wi-Fi + Bluetooth Combo Module
An M.2 version will soon join the Sterling-LWB+ family, powered by the AIROC™ CYW43439 from Infineon Technologies. This addition provides an easy evaluation option for processor EVKs. We are...
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Laird Connectivity Launches Sterling™-LWB+ Wi-Fi 4 + Bluetooth 5.2 Combo Module Based on Latest Infineon AIROC™ CYW43439 Chipset
Akron, Ohio , 27 January 2022 – Global technology leader, Laird Connectivity, has launched the Sterling™-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
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Episode 31: Introducing the Sterling™-LWB+
Ezurio’s new Sterling™-LWB+ Wi-Fi 4 with Bluetooth 5.2 module, based upon the Infineon AIROC™ CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This embedded...
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Zephyr Project Grows with New Memberships and Design Commitments
Ezurio joined the Zephyr RTOS project as a Silver member with the goal of giving our customers more ways to develop their wireless projects, and we continue to invest time and development to...
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Leveraging Next Generation Wi-Fi 6 For Your Embedded Applications
The focus of the presentation will be around the features introduced to the connectivity space by Wi-Fi 6 and how they can be leveraged in the embedded electronics space. Wi-Fi 6 has been promoted...
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Laird Connectivity Announces Fully Featured Wi-Fi 4 + Bluetooth 5.2 Combo Module Based on Latest Infineon AIROC™ CYW43439 Chipset
Akron, Ohio , October 26, 2021 – Global technology leader, Laird Connectivity, has announced the upcoming Sterling-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...
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Coming Soon: Sterling-LWB+ Wi-Fi + Bluetooth Combo Module
The latest member of the successful Sterling-LWB radio family, powered by the new AIROC™ CYW43439 SoC from Infineon Technologies. Introducing the Sterling-LWB+ , the newest Wi-Fi module from...
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Tutorial - How to Integrate Wi-Fi with LWB5+ Dongle in Ubuntu System
Ezurio’s new Sterling-LWB5+ answers the call for next-gen wireless IoT. Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for IIoT connectivity through a secure,...
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Sterling-LWB5+ - Yocto Integration Demo
Ezurio’s new Sterling-LWB5+ answers that call for next-gen wireless IoT. Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for IIoT connectivity through a secure,...