Embedded engineers selecting a Bluetooth module today face a choice that didn't exist two years ago: Nordic's silicon lineup now spans three distinct hardware generations, each representing a...
Selecting a System on Module platform early in a design cycle is one of the highest-leverage decisions an embedded engineer makes — and one of the hardest to reverse. Both the NXP i.MX 93 and i.MX...
Wi-Fi 7 (IEEE 802.11be), the latest generation of Wi-Fi, builds on the foundation of Wi-Fi 6 and Wi-Fi 6E with major improvements in speed, latency, capacity, and efficiency. All three are part of...
This decision of SOMs or an SBC shapes your entire product
Ezurio is always looking toward the future of wireless – as a member of the Bluetooth SIG and as an advocate for our customers. Here’s what we learned about Shorter Connection Interval (SCI) in Bluetooth 6.2.
The right processor decision made early is one of the most valuable investments you can make in a product development program. We're ready to help you make it.
The M.2 standard provides a consistent, predictable packaging for embedded hardware. Standardization has a long record of providing significant advantage in markets and technology where it has been applied, and created an inescapable advantage when looking at the long tail of product lifecycle design.
Learn how Ezurio can help integrate external cameras easily to your design
If you have ever tried to stream high-rate sensor data over Bluetooth Low Energy, you know the frustration: the 2 Mbps PHY sounds fast on paper, but once you factor in connection intervals, L2CAP...
Manufacturing is just the start. The real challenge is maintaining software, managing component changes, certifications, and keeping systems online over many years.
Refresh legacy Bluetooth designs and unlock Bluetooth Core 6.0 LE Audio in one rugged, ready module.
Find out where the MediaTek's Genio-based SOMs, Tungsten 510 and Tungsten700, differentiate.