Vela IF310 - Bluetooth® Classic and LE Audio Module

Under Development: Preview

Overview

Built on Infineon’s AIROC™ CYW55310, the Vela IF310 brings together Bluetooth Classic (BR/EDR) and the full Bluetooth 6.0 LE feature set—including LE Audio with LC3, Isochronous Channels, Auracast, LE Coded & 2 MPHY and Advertising Extensions—so you can refresh legacy Classic designs and embrace the latest LE Audio opportunities with one module. 

A 192 MHz ARM® Cortex-M33, integrated audio interfaces, up to +10 dBm output power and a very flexible HCI UART interface for a variety of hosted/hostless SW architecture options deliver a low-risk, fast-to-market platform for demanding medical or industrial audio and data applications.

Engineered for high-reliability environments, the Vela IF310 is the answer to connectivity challenges where failure is not an option. Whether it’s minimizing downtime in clinical settings or ensuring interference-resistant audio in industrial spaces, this module is built to perform. Its rugged –40 °C to +85 °C operation, robust security features including TrustZone® and CryptoCell-312, and versatile footprint options reflect Ezurio’s commitment to dependable, application-ready solutions. Combined with our personal, hands-on support through every stage of development, the Vela IF310 doesn’t just deliver technology—it delivers peace of mind.


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Auracast™ Enables Transformative New Use Cases

Bluetooth Auracast enables broadcasting of LE audio and innovative new ways to share the audio around us. It supports audio streaming to Bluetooth-enabled hearing aids, multilingual /multichannel broadcast streams, personal audio sharing, stream broadcasting for venues and public spaces, and much more. 

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Specifications

Chipset (Wireless)
Infineon AIROC™ CYW55310
Technology
Bluetooth Core 6.0 - Classic and LE Audio
Antenna Type
Integrated Ignion Antenna, MHF4 Connector, or RF Trace
System Architecture
Hosted to MCU, Hosted to MPU, or Hostless / Standalone
Dimension (Width - mm)
12
Dimension (Length - mm)
16
Dimension (Height - mm)
2
Operating Temp (Max) (°C)
+85
Operating Temp (Min) (°C)
-40
Chipset (MCU)
ARM Cortex-M33 @ 192 MHz
Interfaces - Audio
Dual TDM/I²S plus PCM for HFP, A2DP, LE Audio and multi-stream use cases
Interfaces - General
UART, GPIO, SMIF_SPBH, BT_DEV_WAKE, BT_HOST_WAKE
Memory
2 MB ROM, 768 KB SRAM
Software
Hosted MCU - Bluetooth stack hosted on an external microcontroller
Hosted MPU - Bluetooth stack hosted on an application processor running Linux/Android
Hostless / Standalone - Modus Toolbox (external Flash / PSRAM requirements based on application need)
Transmit Power
Up to +10 dBm
Part NumberPrice @ 1KAntenna TypeChipset (Wireless)PackagingProduct TypeSystem ArchitectureTechnology
453-00390C
453-00390CBuy Options
N/AIntegrated Ignion Antenna Infineon AIROC™ CYW55310 Cut Tape Embedded Module Hosted (MPU), Hosted (MCU), Hostless Bluetooth Core 6.0 (Classic and LE)
453-00390R
453-00390RBuy Options
N/AIntegrated Ignion Antenna Infineon AIROC™ CYW55310 Tape and Reel Embedded Module Hosted (MPU), Hosted (MCU), Hostless Bluetooth Core 6.0 (Classic and LE)
453-00391C
453-00391CBuy Options
N/AMHF4 Connector Infineon AIROC™ CYW55310 Cut Tape Embedded Module Hosted (MPU), Hosted (MCU), Hostless Bluetooth Core 6.0 (Classic and LE)
453-00391R
453-00391RBuy Options
N/AMHF4 Connector Infineon AIROC™ CYW55310 Tape and Reel Embedded Module Hosted (MPU), Hosted (MCU), Hostless Bluetooth Core 6.0 (Classic and LE)
453-00392C
453-00392CBuy Options
N/ATrace Pin Infineon AIROC™ CYW55310 Cut Tape Embedded Module Hosted (MPU), Hosted (MCU), Hostless Bluetooth Core 6.0 (Classic and LE)
453-00392R
453-00392RBuy Options
N/ATrace Pin Infineon AIROC™ CYW55310 Tape and Reel Embedded Module Hosted (MPU), Hosted (MCU), Hostless Bluetooth Core 6.0 (Classic and LE)

Documentation

Browse Product Briefs and Technical Drawings in our Support & Documentation Center.

Browse Vela IF310 Documentation

Preliminary Product Specifications

The Vela IF310 is in Preview stage. For access to early module specifications, please register or sign in with an Ezurio account to access more detailed information.

Learn More

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Apply for our Alpha Program

Ezurio is offering early access to pre-market development kits and samples for the new Vela IF310 modules.

If you're developing next-gen solutions with the Infineon [chipset] chipset, this is your chance to:

  • Get early hardware and documentation
  • Access exclusive dev tools
  • Collaborate directly with Ezurio engineers

Apply now and see if your project qualifies for our Alpha Program.

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Become an Ezurio Customer to Gain Exclusive Access to Our Design Experts

  • Antenna Scans
  • Antenna selection and placement
  • Custom antenna design
  • Worldwide EMC testing / certifications
  • Embedded RF hardware / firmware design
  • Cloud architecture and integration
  • Mobile application development
  • Product & Industrial Design

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Distributors

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