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Unboxing the Sona NX611 Development Kit
In this video, Bob Monroe unboxes the Sona NX611 development kit and walks through the box contents.
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Live at Embedded World 2025: Andy Ross and the Veda SL917
In this video, product manager Andy Ross introduces our Veda SL917 modules, available now in the channel.
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Introducing the CarbonAM67 OSM SOM
Introducing the CarbonAM67 OSM SOM - A system-on-module that has an industry-leading compact size in a reliable solder down form factor.
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Introducing the Carbon AM62 OSM SOM
Introducing the Carbon AM62 OSM SOM - A system-on-module that has an industry-leading compact size in a reliable solder down form factor.
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Introducing the Veda SL917
Introducing a new Veda family of connected MCU from Ezurio, the Veda SL917, based upon the Silicon Labs SiWx917 chipset.
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Introducing the Sona NX611 Series
Our Sona NX611 is our most form-factor diverse Wi-Fi 6E + Bluetooth 5.4 module available, based on the industry-leading NXP IW611 silicon.
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Introducing the Sona TI351 Wi-Fi 6 + Bluetooth 5.4 Module
In this video, product manager Andy Ross explains what makes the Sona TI351 unique among our offerings.
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Introducing the MT320
Our Sona™ MT320, is the first industrial grade Wi-Fi/BT module based upon the technology leading MediaTek Filogic 320 (MT7921) Wi-Fi 6 chipset.
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Introducing the Sona IF513 Series
In this video, product manager Andy Ross explains the unique place our Sona IF513 Series has in our line of Wi-Fi 6/6E + Bluetooth modules.
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Demonstrating the RM126x in Peer to Peer Mode
In this video, FAE Damien Fourcade demonstrates the RM126x Series in Peer to Peer mode via LoRaWAN.
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Connecting the RM126x to The Things Stack / TTN
In this demonstration, the RM126x development kit is connected to a RG186 LoRaWAN gateway, and sends AT commands over LoRaWAN to the gateway, which are then registered in the cloud.
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Unboxing the RM126x Series Development Kit
In this video, our field application engineer Damien Fourcade details some features and capabilities of the RM126x development kits, as well as demonstrates unboxing and what is featured on the boards.
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Introducing the RM126x Series
The Ezurio RM126x series of modules (RM1261 and RM1262) is based on Silicon Labs EFR32 MCU and the Semtech SX126x radio. They provide a low power, long range solution for you to easily develop your...
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Coming Soon: Sterling-LWB+ M.2 Wi-Fi + Bluetooth Combo Module
An M.2 version will soon join the Sterling-LWB+ family, powered by the AIROC™ CYW43439 from Infineon Technologies. This addition provides an easy evaluation option for processor EVKs. We are...
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Introduction - Lyra Series Bluetooth 5.3 Modules
The newest addition to Ezurio’s extensive Bluetooth Low Energy product range is the Lyra Series, based on Silicon Labs EFR32BG22 SoC. This range of flexible modules marries all the benefits of...
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Coming Soon: Advanced Bluetooth LE Module Series in Partnership with Silicon Labs
The Lyra Series of Bluetooth LE modules based on Silicon Labs SoC is a major addition to our industry-leading portfolio of Bluetooth solutions. We are excited to announce that we have partnered with...
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Now Available: Sterling™-LWB+ WiFi + Bluetooth Combo Module
The latest member of the successful Sterling-LWB radio family, powered by the AIROC™ CYW43439 SoC from Infineon Technologies. Our Sterling™-LWB+ Wi-Fi module series is now available. Powered...
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Episode 31: Introducing the Sterling™-LWB+
Ezurio’s new Sterling™-LWB+ Wi-Fi 4 with Bluetooth 5.2 module, based upon the Infineon AIROC™ CYW43439 chipset, is the latest member of the successful Sterling-LWB radio family. This embedded...
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Coming Soon: Sterling-LWB+ Wi-Fi + Bluetooth Combo Module
The latest member of the successful Sterling-LWB radio family, powered by the new AIROC™ CYW43439 SoC from Infineon Technologies. Introducing the Sterling-LWB+ , the newest Wi-Fi module from...
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Introducing the Sterling-LWB5+ Wi-Fi 5 + Bluetooth 5 Module
Ezurio's new Sterling-LWB5+ is purpose-built from customer feedback to create a truly robust industrial IoT Module. Designed for ease of manufacturing, reliable connectivity, easy integration, and to...
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Episode 21: Unboxing the Sterling LWB5+ Development Kit
The Sterling-LWB5+ is our latest in our line of Sterling Wi-Fi + Blutooth Modules. Featuring 802.11ac Wi-Fi and Bluetooth 5 (Classic BT + LE), it's an offering that addresses directly our customers'...
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Laird Connectivity and Cypress Deliver New Wi-Fi® + Bluetooth® 5 Combo Module Purpose-Built for Industrial IoT
Akron, Ohio , June 11, 2020 – Global technology leader, Laird Connectivity, has announced the upcoming Sterling-LWB5+ Wi-Fi 5 (802.11ac) and Bluetooth 5.1 module. Powered by...
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New Bluetooth 5.1 Modules for Next Gen Industrial IoT
Introducing the new BL653 Bluetooth 5.1 module series. The BL653 is a complete multi-protocol embedded wireless module that delivers longer range, multi-wireless capabilities, and extended...
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Introducing the Sterling-EWB IoT Module
Our Sterling-EWB is available at distributors now! The Sterling-EWB is a small, smart, wireless module built with the IoT in mind. It combines 802.11n Wi-Fi, Bluetooth 4.2, and an onboard Cortex M4F...
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Configure the BT830 Quickly and Easily with BooTpatch from Laird
Laird's BooTpatch driver simplifies configuration of the BT830 module in any host device running Windows CE/Mobile, setting the configuration when the host device boots. In this demonstration, we...
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Jump-Start Your BLE Mesh Development!
Laird has released a new firmware package for the BL652 series of Bluetooth modules enabling alpha BLE Mesh functionality, based on Nordic’s BLE Mesh SDK (v0.10.0). With just a few development kits...
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Certification, EMC Testing, and Standards Update
North America (FCC, Industry Canada): The FCC Office of Engineering and Technology (OET) laboratory division released an update to KDB Publication Number 447498 on January 29th, 2013; which...
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Dont Forget: The 5 Basics of RF Design
If it's time to go wireless, don't forget the basics of RF Design . You may be excited about your new wireless project: innovative design, environmentally friendly, consumer demand, and the list...